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High-density I/O for next-generation quantum annealing: Part 2—Device packaging

ORAL

Abstract

As superconducting quantum processors continue to scale up in size, it becomes increasingly challenging to route the required number of control lines through a dilution refrigerator to the qubit chip. In this presentation, we will discuss our efforts to develop high-density packaging for use in next-generation quantum annealers. Our packaging solutions integrate with our low crosstalk flexible multi-channel cables, and are designed to maintain isolation and moderate bandwidth. We will describe the design and electrical performance of the packages.

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Presenters

  • John Cummings

    MIT Lincoln Lab, MIT Lincoln Laboratory

Authors

  • John Cummings

    MIT Lincoln Lab, MIT Lincoln Laboratory

  • Steven Weber

    MIT Lincoln Laboratory, MIT Lincoln Lab, Lincoln Laboratory, MIT, MIT - Lincoln Laboratory

  • Jovi Miloshi

    MIT Lincoln Lab

  • Kyle J Thompson

    MIT Lincoln Lab

  • John Rokosz

    MIT Lincoln Lab

  • David Holtman

    MIT Lincoln Lab

  • David Conway

    MIT Lincoln Lab

  • Andrew James Kerman

    MIT Lincoln Laboratory, MIT Lincoln Lab, Lincoln Laboratory, MIT, MIT - Lincoln Laboratory

  • William Oliver

    MIT Lincoln Laboratory, Research Laboratory of Electronics, Massachusetts Institute of Technology, Research Laboratory of Electronics, MIT Lincoln Laboratory, Department of Electrical Engineering and Computer Science, MIT Research Laboratory of Electronics, MIT Lincoln Laboratory, MIT Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology MIT, Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology, MIT Lincoln Laboratory, MIT, MIT, MIT Lincoln Lab, MIT Lincoln Lab, MIT Lincoln Lab, Massachusetts Institute of Technology, Research Laboratory of Electronics, Department of Electrical Engineering and Computer Science, and Department of Physics, Massachusetts Institute of Technology. MIT Lincoln L, Department of Physics, Department of Electrical Engineering & Computer Science, Research Laboratory of Electronics, MIT Lincoln Laboratory, Massachusetts Institute of Technol, Lincoln Laboratory, Research Laboratory of Electronics, and Department of Electrical Engineering & Computer Science, MIT