I/O, Packaging, and 3D Integration for Superconducting and Semiconductor Qubits II

I/O, Packaging, and 3D Integration for Superconducting and Semiconductor Qubits II

FOCUS · M30 · ID: 380894

Presentations

CMOS-based cryogenic control of silicon quantum circuits

ORAL

March 17, 2021, 12:30 PM – March 17, 2021, 12:42 PM
Presenters
- Bishnu Patra
  
  Delft University of Technology
Authors
- Bishnu Patra
  
  Delft University of Technology
- Xiao Xue
  
  Delft University of Technology
- Jeroen van Dijk
  
  Delft University of Technology
- Nodar Samkharadze
  
  Netherlands Organization for Applied Scientific Research (TNO)
- Sushil Subramanian
  
  Intel Corporation
- Andrea Corna
  
  Delft University of Technology
- Charles Jeon
  
  Intel Corporation
- Farhana Sheikh
  
  Intel Corporation
- Esdras Juarez-Hernandez
  
  Intel Corporation
- Brando Perez Esparza
  
  Intel Corporation
- Huzaifa Rampurawala
  
  Intel Corporation
- Brent Carlton
  
  Intel Corporation
- Surej Ravikumar
  
  Intel Corporation
- Carlos Nieva
  
  Intel Corporation
- Sungwon Kim
  
  Intel Corporation
- Hyung-Jin Lee
  
  Intel Corporation
- Amir Sammak
  
  QuTech and Netherlands Organisation for Applied Scientific Research (TNO), TNO, QuTech, Delft University of Technology, Netherlands Organization for Applied Scientific Research (TNO), Delft University of Technology
- Giordano Scappucci
  
  Delft University of Technology, QuTech, Delft University of Technology, QuTech and Kavli Institute of Nanoscience, TU Delft, QuTech and Kavli Institute of Nanoscience, Delft University of Technology
- Menno Veldhorst
  
  QuTech, Delft University of Technology, Delft University of Technology, QuTech and Kavli Institute of Nanoscience, Delft University of Technology
- Fabio Sebastiano
  
  Delft University of Technology
- Masoud Babaie
  
  Delft University of Technology
- Stefano Pellerano
  
  Intel Corporation
- Edoardo Charbon
  
  École Polytechnique Fédérale de Lausanne (EPFL)
- Lieven Vandersypen
  
  Delft University of Technology, Qutech and Kavli Institute of Nanoscience, Delft University of Technology, QuTech, Delft University of Technology, QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Qutech, Delft University of Technology
View abstract →
Flexible Coaxial Ribbon Cable for High-Density Superconducting Microwave Device Arrays

ORAL

March 17, 2021, 12:42 PM – March 17, 2021, 12:54 PM
Presenters
- Jenny Smith
  
  University of California, Santa Barbara
Authors
- Jenny Smith
  
  University of California, Santa Barbara
- Benjamin Mazin
  
  University of California, Santa Barbara
- Alex Walter
  
  NASA Jet Propulsion Laboratory
- Miguel Daal
  
  University of California, Santa Barbara
- J. I. Bailey
  
  University of California, Santa Barbara
- Clinton Bockstiegel
  
  University of California, Santa Barbara
- Nicholas Zobrist
  
  University of California, Santa Barbara
- Noah Swimmer
  
  University of California, Santa Barbara
- Sarah Steiger
  
  University of California, Santa Barbara
- Neelay Fruitwala
  
  University of California, Santa Barbara
View abstract →
Customized high channel density and IR-filtered cryogenic cable solution characterization for quantum test environments

ORAL

March 17, 2021, 12:54 PM – March 17, 2021, 1:06 PM
Presenters
- Laurent Colas
  
  Institut quantique, Université de Sherbrooke
Authors
- Marc-André Tétrault
  
  Institut quantique, Université de Sherbrooke
- Laurent Colas
  
  Institut quantique, Université de Sherbrooke
- Chun Heung Wong
  
  Delft Circuits
- Kiefer Vermeulen
  
  Delft Circuits
- Wouter Bos
  
  Delft Circuits
- Daan Kuitenbrouwer
  
  Delft Circuits
- Michael michael.r.lacerte@USherbrooke.ca
  
  Institut quantique, Université de Sherbrooke
- Michel Pioro-Ladriere
  
  Institut quantique, Université de Sherbrooke, Physics, Université de Sherbrooke, Sherbrooke, Canada, Universite de Sherbrooke
View abstract →
Motherboard for superconducting qubit readout

ORAL

March 17, 2021, 1:06 PM – March 17, 2021, 1:18 PM
Presenters
- Baleegh Abdo
  
  IBM TJ Watson Research Center
Authors
- Baleegh Abdo
  
  IBM TJ Watson Research Center
- Michael Beckley
  
  IBM Almaden Research Center
- Charles Rettner
  
  IBM Quantum, IBM Almaden Research Center, San Jose, CA 95120, USA, IBM Almaden Research Center
- Bryan Trimm
  
  IBM Quantum, IBM T. J. Watson Research Center, Yorktown Heights, NY 10598, USA, IBM TJ Watson Research Center
- Teddie Magbitang
  
  IBM Almaden Research Center
- Jae-woong Nah
  
  IBM TJ Watson Research Center
- Salvatore Olivadese
  
  IBM TJ Watson Research Center
- Nick Bronn
  
  IBM TJ Watson Research Center
- Oblesh Jinka
  
  IBM TJ Watson Research Center
View abstract →
Control and readout of a superconducting qubit using a photonic link

ORAL

March 17, 2021, 1:18 PM – March 17, 2021, 1:30 PM
Presenters
- Florent Lecocq
  
  National Institute of Standards and Technology, National Institute of Standards and Technology Boulder, National Institute of Standards and Technology, Boulder, USA
Authors
- Florent Lecocq
  
  National Institute of Standards and Technology, National Institute of Standards and Technology Boulder, National Institute of Standards and Technology, Boulder, USA
- Franklyn Quinlan
  
  National Institute of Standards and Technology Boulder
- Katarina Cicak
  
  National Institute of Standards and Technology, National Institute of Standards and Technology Boulder, National Institute of Standards and Technology, Boulder, USA
- Jose Aumentado
  
  National Institute of Standards and Technology Boulder, National Institute of Standards and Technology, National Institute of Standards and Technology, Boulder, USA
- Scott Alan Diddams
  
  National Institute of Standards and Technology Boulder
- John Teufel
  
  National Institute of Standards and Technology, National Institute of Standards and Technology Boulder, National Institute of Standards and Technology, Boulder, USA
View abstract →
Coherent on-chip microwave source based on a voltage-biased Josephson junction

ORAL

March 17, 2021, 1:30 PM – March 17, 2021, 1:42 PM
Presenters
- Chengyu Yan
  
  QCD Labs, Department of Applied Physics, Aalto University
Authors
- Chengyu Yan
  
  QCD Labs, Department of Applied Physics, Aalto University
- Juha Hassel
  
  IQM Quantum Computers, IQM, VTT Technical Research Centre of Finland Ltd, IQM Finland Oy
- Visa Vesterinen
  
  VTT, VTT Micro & Nanoelectronics, VTT Techical Research Center of Finland Ltd., VTT Technical Research Centre of Finland Ltd
- Jinli Zhang
  
  QCD Labs, Department of Applied Physics, Aalto University
- Joni Ikonen
  
  IQM Quantum Computers, QCD Labs, Department of Applied Physics, Aalto University, IQM, IQM Finland Oy
- Leif Grönberg
  
  VTT Micro & Nanoelectronics, VTT Techical Research Center of Finland Ltd., VTT Technical Research Centre of Finland Ltd, QTF Centre of Excellence, VTT Technical Research Centre of Finland Ltd.
- Jan Goetz
  
  IQM
- Mikko Möttönen
  
  QCD Labs, Aalto University, QCD Labs, Department of Applied Physics, Aalto University, IQM Finland Oy
View abstract →
A 22nm FD-SOI-CMOS Scalable Quantum Processor SoC with Fully Integrated Control Electronics at 3.5K

ORAL

March 17, 2021, 1:42 PM – March 17, 2021, 1:54 PM
Presenters
- IMRAN BASHIR
  
  Design, Equal1 Labs Inc.
Authors
- IMRAN BASHIR
  
  Design, Equal1 Labs Inc.
- Dirk R Leipold
  
  Design, Equal1 Labs Inc.
- Mike Asker
  
  Design, Equal1 Labs Inc.
- Elena Blokhina
  
  Design, Equal1 Labs Inc.
- David Redmond
  
  Design, Equal1 Labs Inc.
- Bogdan Staszewski
  
  Univ Coll Dublin
- Ali Esmailiyan
  
  Design, Equal1 Labs Inc.
- Panagiotis Giounanlis
  
  Design, Equal1 Labs Inc.
- Dennis Andrademiceli
  
  Univ Coll Dublin
- Andrii Sokolov
  
  Univ Coll Dublin
- Xutong Wu
  
  Univ Coll Dublin
View abstract →
High-density I/O for next-generation quantum annealing: Part 1—Cryogenic wiring

ORAL

March 17, 2021, 1:54 PM – March 17, 2021, 2:06 PM
Presenters
- Steven Weber
  
  MIT Lincoln Laboratory, MIT Lincoln Lab, Lincoln Laboratory, MIT, MIT - Lincoln Laboratory
Authors
- Steven Weber
  
  MIT Lincoln Laboratory, MIT Lincoln Lab, Lincoln Laboratory, MIT, MIT - Lincoln Laboratory
- John Cummings
  
  MIT Lincoln Lab
- Jovi Miloshi
  
  MIT Lincoln Lab
- Kyle J Thompson
  
  MIT Lincoln Lab
- John Rokosz
  
  MIT Lincoln Lab
- David Holtman
  
  MIT Lincoln Lab
- David Conway
  
  MIT Lincoln Lab
- Andrew James Kerman
  
  MIT Lincoln Laboratory, MIT Lincoln Lab, Lincoln Laboratory, MIT, MIT - Lincoln Laboratory
- William Oliver
  
  MIT, MIT Lincoln Lab
View abstract →
High-density I/O for next-generation quantum annealing: Part 2—Device packaging

ORAL

March 17, 2021, 2:06 PM – March 17, 2021, 2:18 PM
Presenters
- John Cummings
  
  MIT Lincoln Lab, MIT Lincoln Laboratory
Authors
- John Cummings
  
  MIT Lincoln Lab, MIT Lincoln Laboratory
- Steven Weber
  
  MIT Lincoln Laboratory, MIT Lincoln Lab, Lincoln Laboratory, MIT, MIT - Lincoln Laboratory
- Jovi Miloshi
  
  MIT Lincoln Lab
- Kyle J Thompson
  
  MIT Lincoln Lab
- John Rokosz
  
  MIT Lincoln Lab
- David Holtman
  
  MIT Lincoln Lab
- David Conway
  
  MIT Lincoln Lab
- Andrew James Kerman
  
  MIT Lincoln Laboratory, MIT Lincoln Lab, Lincoln Laboratory, MIT, MIT - Lincoln Laboratory
- William Oliver
  
  MIT Lincoln Laboratory, Research Laboratory of Electronics, Massachusetts Institute of Technology, Research Laboratory of Electronics, MIT Lincoln Laboratory, Department of Electrical Engineering and Computer Science, MIT Research Laboratory of Electronics, MIT Lincoln Laboratory, MIT Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology MIT, Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology, MIT Lincoln Laboratory, MIT, MIT, MIT Lincoln Lab, MIT Lincoln Lab, MIT Lincoln Lab, Massachusetts Institute of Technology, Research Laboratory of Electronics, Department of Electrical Engineering and Computer Science, and Department of Physics, Massachusetts Institute of Technology. MIT Lincoln L, Department of Physics, Department of Electrical Engineering & Computer Science, Research Laboratory of Electronics, MIT Lincoln Laboratory, Massachusetts Institute of Technol, Lincoln Laboratory, Research Laboratory of Electronics, and Department of Electrical Engineering & Computer Science, MIT
View abstract →
Cryogenic microwave frequency filters beyond 20 GHz and their impact on superconducting quantum circuits

ORAL

March 17, 2021, 2:18 PM – March 17, 2021, 2:30 PM
Presenters
- Sergey Danilin
  
  James Watt School of Engineering, University of Glasgow
Authors
- Sergey Danilin
  
  James Watt School of Engineering, University of Glasgow
- Joao Barbosa
  
  James Watt School of Engineering, University of Glasgow
- Zimo Zhao
  
  James Watt School of Engineering, University of Glasgow
- Michael Farage
  
  James Watt School of Engineering, University of Glasgow
- Jonathan Burnett
  
  National Physical Laboratory, United Kingdom
- Chong Li
  
  James Watt School of Engineering, University of Glasgow
- Martin P. Weides
  
  James Watt School of Engineering, University of Glasgow
View abstract →
Challenges and methodology of assembing Edgeless Four Side Tileable ROICs for a Wafer Scale, Deadzone-less Camera utilizing high density interconnects.

Invited

March 17, 2021, 2:30 PM – March 17, 2021, 3:06 PM
Presenters
- Farah Fahim
  
  Fermi National Accelerator Laboratory
Authors
- Farah Fahim
  
  Fermi National Accelerator Laboratory
View abstract →
Scalable Quantum i/o: Integrated Cryogenic Microwave Components in Flexible Stripline Structures

ORAL

March 17, 2021, 3:06 PM – March 17, 2021, 3:18 PM
Presenters
- Chun Heung Wong
  
  Delft Circuits
Authors
- Chun Heung Wong
  
  Delft Circuits
- Kiefer Vermeulen
  
  Delft Circuits
- Wouter Bos
  
  Delft Circuits
- Ruben van Gulik
  
  Delft Circuits
- Riemer Sorgedrager
  
  Delft Circuits
- Matthew Sarsby
  
  QuTech, Delft University of Technology
- Daan Kuitenbrouwer
  
  Delft Circuits
- Rob van den Brink
  
  Delft Circuits
- Jakob Kammhuber
  
  Delft Circuits
- Sal Jua Bosman
  
  Delft Circuits
View abstract →

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