High-density I/O for next-generation quantum annealing: Part 1—Cryogenic wiring
ORAL
Abstract
As superconducting quantum processors continue to scale up in size, it becomes increasingly challenging to route the required number of control lines through a dilution refrigerator to the qubit chip. In this presentation, we will discuss our efforts to develop high-density fridge wiring for use in next-generation quantum annealers. Our wiring solution is based on flexible multi-channel cables with a stripline geometry, designed to achieve low crosstalk and moderate bandwidth. We will describe the electrical performance of these cables, as well as other design considerations such as thermal management.
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Presenters
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Steven Weber
MIT Lincoln Laboratory, MIT Lincoln Lab, Lincoln Laboratory, MIT, MIT - Lincoln Laboratory
Authors
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Steven Weber
MIT Lincoln Laboratory, MIT Lincoln Lab, Lincoln Laboratory, MIT, MIT - Lincoln Laboratory
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John Cummings
MIT Lincoln Lab
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Jovi Miloshi
MIT Lincoln Lab
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Kyle J Thompson
MIT Lincoln Lab
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John Rokosz
MIT Lincoln Lab
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David Holtman
MIT Lincoln Lab
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David Conway
MIT Lincoln Lab
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Andrew James Kerman
MIT Lincoln Laboratory, MIT Lincoln Lab, Lincoln Laboratory, MIT, MIT - Lincoln Laboratory
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William Oliver
MIT, MIT Lincoln Lab