Challenges and methodology of assembing Edgeless Four Side Tileable ROICs for a Wafer Scale, Deadzone-less Camera utilizing high density interconnects.

Deadzone-less, large area camera systems can be assembled by connecting wafer scale sensors to an array of almost reticule size, 4-side tileable, edgeless readout integrated circuits (ROIC). The design of truly edgeless ROICs, with active area extending to their edges, has been made possible with the advent of 3D integration technologies with high-density interconnects, which enable new routing and I/O paradigms. Despite their obvious potential, the realization and widespread development of truly edgeless ROICs to create gapless dectors has faced several obstacles including manufacturing processes related to 3D integration, identification of known good dies and edgeless design methodologies. The advancements required in "thru via" approaches and wafer bonding and its impact on developing integrated electronics required for Quantum and AI will be discussed.