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Determining Lamellar Structure with Soft X-ray Reflectivity

ORAL

Abstract

Nanostructured polymer thin films have been studied for a variety of applications including electronic transistors, membranes for separations, and bit-patterned media. The formation of the nanostructure is dependent on three polymer properties: the composition of the block copolymer, fA, the interaction parameter between the homopolymer components, χ, and overall chain length of the polymer, N. While composition and chain length can be easily tuned during polymer synthesis, χ is dependent on copolymer chemistry and, therefore, is difficult to tune. We have devised a model block copolymer system to systematically tune χ through use of modular A-b-(B-r-C) copolymers. The nanostructure can be tuned by changing the chemical identities of blocks B and C, as well as the volume fraction of component B to C, φ. Through resonant soft X-ray reflectivity (RSoXR), we have determined the effect of φ on the self-assembly of lamellar thin films through measurements of the interface width. The thin-film measurements are compared with predictions from bulk using strong segregation theory. Our results provide insights into the effect of molecular structure on block copolymer self-assembly to help enable predictive design of nanostructured materials.

Presenters

  • Whitney Loo

    University of California, Berkeley, University of Chicago, Chemical and Biomolecular Engineering, University of California, Berkeley

Authors

  • Whitney Loo

    University of California, Berkeley, University of Chicago, Chemical and Biomolecular Engineering, University of California, Berkeley

  • Hongbo Feng

    Molecular Engineering, University of Chicago, University of Chicago

  • Daniel Sunday

    National Institute of Standards and Technology, National Institute for Standards and Technology

  • Paul F Nealey

    Molecular Engineering, University of Chicago, Pritzker School of Molecular Engineering, University of Chicago, University of Chicago, Institute for Molecular Engineering, University of Chicago