3D Package for Quantum Integrated Circuits

Scaling challenges that arise from increasing the qubit count and interconnect density in quantum circuits requires the development of novel microwave and cryogenic packaging solutions. Beyond approximately 50 qubits, a perimeter chip interface becomes the limiting factor for scalability and 3D signalling solutions are required to control a large number of qubits. We present a 3D package that leverages existing vertical interconnect technology and newly developed chip interface management for cryogenic environments. This approach allows us to individually control and measure the qubits on a larger scale without compromising signal integrity.