The industrial application of remote plasma sources as an enabling technology for 3D semiconductor fabrications

Plasma technology is now used across virtually all areas of semiconductor manufacturing—not only in front-end processes, but also as a critical enabler in advanced packaging technologies. As logic, DRAM, and flash devices continue their transition toward 3D architectures and atomic-level processing, the complexity of process requirements has significantly increased. As a result, it has become necessary to revisit and reassess traditional plasma technologies.

The ability of remote plasma source to utilize radicals without causing surface damage is becoming ever more critial. Also. The need for precise control over these plasmas to meet the demands of advanced semiconductor processing is equally important.

This presentation will review the current applications of remote plasma in semiconductor manufacturing and discuss the necessary requirements for next-generation processes. It will also explore the supporting roles of RF power sources and plasma sensing capabilities in advancing plasma source technologies.

Finally, we will highlight the development of state-of-the-art remote plasma systems utilizing transformer-coupled plasma (TCP) and microwave plasma, aimed at enabling next-generation ALD processes. We will also propose potential directions for addressing the challenges the industry must tackle collectively.