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The Future Challenges of Semiconductor Processing

ORAL · Invited

Abstract

We live in a digitally connected world that is generating and processing data unlike ever before. This is driving exponential growth in the demand for computing power and data storage. This is a technology driven transformation and innovations in semiconductor processing capability are required to enable system bandwidth, increased data density and lower power operation. While scaling continues in the x and y direction we continue to explore ways to improve the vertical scaling of semiconductor devices. We have already seen NAND and CMOS technology scale in the z-direction and options to scale DRAM in this way are also being developed.

The continued scaling of devices increases the Aspect Ratio of features and requires tighter control of ion energy distributions. The tighter x and y pitches require lower damage and passivation layers while also enabling tighter control of feature profiles. The control of Critical Dimensions now needs to be controlled down to the sub 1nm range. Variations from Multi-Patterning processes and EUV lithography roughness are becoming major roadblocks for the future x-y scaling of DRAM technology. Multi-Patterning of EUV is already in development for next generation DRAM nodes. New materials are being regularly introduced to enable the continued reduction of resistance, capacitance, and process margins. Wafer bonding is also becoming a critical part of the scaling roadmap.

Continued scaling reduces cost due to increasing device density, but also comes at a cost due to increased process complexity, material cost, and process time. Developing way to reduce the node over node cost increase is critical to support the technology innovation and cadence. Modeling and Data Science have greatly increased in use over the last few years as ways to provide early guidance on process and device solutions as well as lower the number of empirical experiments required to develop a new process.

All of this needs to be done with the backdrop of our impact to the environment. Ways to conserve energy and water, and reduce CO2 emissions and waste are critical to a brighter future.

Presenters

  • Aaron Wilson

    Micron Technology Inc.

Authors

  • Aaron Wilson

    Micron Technology Inc.