Analysis of Temperature Distribution Affected by Convection to Ring Electrode in Double-Flow Type Gas Circuit Breaker

Yuji Komai; Sergey Leonov; Sergey Leonov; Sergey Leonov; Sergey Leonov

Analysis of Temperature Distribution Affected by Convection to Ring Electrode in Double-Flow Type Gas Circuit Breaker

POSTER

Abstract

The arc temperature affected by the convection to ring electrode in double-flow type gas circuit breaker (GCB) was analyzed. The objective of this research to elucidate the contribution to arc extinction affected by the convection to ring electrode. GCB is an electric power equipment in order to interrupt the current quickly. The compressed gas in thermal chamber flows out in the two opposite directions to quench the arc plasma. The arc column is strongly curved and significantly lengthened by the convection of two opposite directions. Thus, it has been reported that the double-flow type GCB interrupts the current more easily than the single-flow type GCB. However, contribution of the convection to ring electrode for arc extinction in double-flow type GCB is not elucidated. In this paper, analysis of temperature distribution in double-flow type gas circuit breaker using 3-D electromagnetic thermal fluid simulation is investigated. As a result, the flow velocity to the ring electrode increased and the high temperature gas was transported with increasing the pressure of ring electrode area. Therefore, it was suggested that the flow field to electrode ring contributes the improvement of current interruption performance.

Authors

Yuji Komai

Tokyo City University
Sergey Leonov

Naval Research Laboratory, Washington, DC 20375, Applied Materials Inc, Grad. School of Eng., Tohoku University, Graduate School of Engineering, Tohoku University, Retired, Dalian University of Technology, Michigan State University, Texas A&M University, Teagasc, Dublin City University, GREMI, University of Orleans, Polytech Orleans, University of Orleans, Kyoto Institute of Technology, Eindhoven University of Technology, VDL Enabling Technologies Group, Ruhr-University Bochum, Leuphana University Luneburg, North Carolina State University, Applied Materials Inc., Tokyo Metropolitan University, Hokkaido University, LPP and LPICM, CNRS, Ecole Polytechnique,Tu/e, The Netherlands, CWI Amsterdam and Eindhoven Univ Techn, Oak Ridge National Laboratory, Idaho National Laboratory, School of Physics, Huazhong University of Science and Technology, Wuhan 430074, China, Princeton Plasma Physics Laboratory, Princeton University, Princeton, New Jersy 08543, USA, ITER-India, IPR, Gandhinagar, India, 382428, DA-IICT, Gandhinagar, India, 382007, Samsung Electronics Co., US Army SMDC/Army Forces Strategic Command, UAH Systems Management and Production Center, University of Alabama in Huntsville, Moscow Institute of Physics and Technology, CNRS Institut Pprime, University of Poitiers, CNRS, Ecole Polytechnique, Samsung Electronics Company, Ltd., Ruhr University Bochum, LPGP CNRS Univ. Paris-Sud Univ. Paris-Saclay, LSPM CNRS UPR 3407 UNIV. PARIS 13 SORBONNE PARIS CITE, Missouri University of Science and Technology, Tblisi State University, ELI Prague, United Arab Emirates University, Tokyo City University, Princeton Plasma Physics Laboratory, The University of Texas at Dallas, Key Laboratory of Materials Modification by Laser, Ion, and Electron Beams (Ministry of Education), School of Physics, Dalian University of Technology, Department of Electrical Engineering, Hanyang University, Department of Physics & Biophysics, University of San Diego, Lynntech Inc., Honeybee Robotics, Ltd, NASA Jet Propulsion Laboratory, Texas A\&M University, The University of Tokyo, Nihon University, Kyushu University, National Institute for Basic Biology, National Institute for Fusion Science, Loma Linda University, Division of Infection Prevention and Control, Tokyo healthcare university, FIRST, Tokyo Institute of Technology, Pohang University of Science and Technology, Masaryk University, Brno, Czech Republic, Institute of Plasma Physics, CAS, Prague, Czech Republic, Michigan State Univ, Nagoya University, Nagoya Industries Promotion Corporation, Leibniz Institute for Plasma Science and Technology (INP), Meijo University, Samsung electronics, The university of texas at austin, Esgee Technologies Inc, Leuphana University Lüneburg, ITER-India, Institute for Plasma Research (IPR), Gandhinagar, India, 382428, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, 382007, Ulsan National Institute of Science and Technology, University of Wisconsin - Madison, Texas Tech Univ, Lubbock, TX, Kinema Research, Colorado, SRC Triniti, Russia, CERN, RD51 Collaboration, IPFN/IST-UTL, Portugal, TRINITI, Los Alamos National Laboratory, Drexel University, Advanced Research Center for Nanolithography, University of Kentucky, Illinois Wesleyan University, Applied Materials, Inc., The University of Texas at Austin, Esgee Technologies Inc., Tokyo Electron America, Inc., Samsung Electronics Mechatronics Division, PIIM, Aix-Marseille University, France, University of York, UK, LSPM, Universit\'e Paris 13, France, Curtin University, University of Surrey, Gifu University, Chiba Institute of Technology, Dublin City University, Ireland, Teagasc, Ireland, Chevron Energy Technology Company, USA, Texas A&M University Department of Mechanical Engineering, Plasma Engineering and Non-equilibrium Processing Laboratory at Texas A\&M University, National Center for Electron Beam Research at Texas A\&M University, Sandia National Laboratories, Hanyang University, Korea Research Institute of Standards and Science, Korea Research Institute of Standards and Science, Chungnam National University, Hungarian Academy of Sciences, Hungarian Academy of Sciences, West Virginia University, Ruhr-University Bochum, West Virginia University, V.N. Karazin Kharkiv National University, Wigner Research Centre for Physics, Ruhr-University, West Virginia University; Ruhr-University, Wigner Research Centre for Physics; West Virginia University, Dalian University of Technology, China, University of Houston, USA, University of California, USA, CEA/CESTA, Tokyo Institute of Technology, Leibniz Institute for Plasma Science and Technology, Greifswald, Germany, University of Cambridge, Stanford University, Mechanical Engineering Department, Stanford University, LAPLACE Laboratory, Toulouse, France, Princeton Plasma Physics Laboratory, Princeton, New Jersey, USA, University of Saskatchewan, Saskatoon, Canada, Institute of Physics, National Academy of Sciences of Ukraine, Institute of Semiconductor Physics, National Academy of Sciences of Ukraine, Princeton University, Metro Laser Co, IPFN/IST-UL, University of South Carolina, York Plasma Institute, Department of Physics, University of York, York, YO10 5DD, U.K., Leibniz Institute for Plasma Science and Technology (INP), 17489 Greifswald, Germany, LAPLACE, CNRS and Univ. Toulouse III, France, Stockholm University, Swansea University, Dalian Maritime University, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, LTEOil LLC, Department of Mechanical Engineering, Texas A\&M University, College Station, Osaka City University, qfan@egr.msu.edu, Department of Electrical Engineering and Information Science, Ruhr-University Bochum, Germany, Institute for Solid State Physics and Optics, Wigner Research Centre for Physics, Hungarian Academy of Sciences, Budapest, Hungary, PlasmaPotential—Physics Consulting and Research, Canberra, Australia, University of Notre Dame, Chungnam National University, Chungnam National University, Nanotech Optoelectronics Research Center, Samsung Electronics Co., Ltd., Laboratoire de physique des plasmas, Ecole Polytechnique, centre de mathematiques appliques, Xi'an Jiaotong University, Ferdinand Braun Institute Berlin, Texas A/&M University
Sergey Leonov

Naval Research Laboratory, Washington, DC 20375, Applied Materials Inc, Grad. School of Eng., Tohoku University, Graduate School of Engineering, Tohoku University, Retired, Dalian University of Technology, Michigan State University, Texas A&M University, Teagasc, Dublin City University, GREMI, University of Orleans, Polytech Orleans, University of Orleans, Kyoto Institute of Technology, Eindhoven University of Technology, VDL Enabling Technologies Group, Ruhr-University Bochum, Leuphana University Luneburg, North Carolina State University, Applied Materials Inc., Tokyo Metropolitan University, Hokkaido University, LPP and LPICM, CNRS, Ecole Polytechnique,Tu/e, The Netherlands, CWI Amsterdam and Eindhoven Univ Techn, Oak Ridge National Laboratory, Idaho National Laboratory, School of Physics, Huazhong University of Science and Technology, Wuhan 430074, China, Princeton Plasma Physics Laboratory, Princeton University, Princeton, New Jersy 08543, USA, ITER-India, IPR, Gandhinagar, India, 382428, DA-IICT, Gandhinagar, India, 382007, Samsung Electronics Co., US Army SMDC/Army Forces Strategic Command, UAH Systems Management and Production Center, University of Alabama in Huntsville, Moscow Institute of Physics and Technology, CNRS Institut Pprime, University of Poitiers, CNRS, Ecole Polytechnique, Samsung Electronics Company, Ltd., Ruhr University Bochum, LPGP CNRS Univ. Paris-Sud Univ. Paris-Saclay, LSPM CNRS UPR 3407 UNIV. PARIS 13 SORBONNE PARIS CITE, Missouri University of Science and Technology, Tblisi State University, ELI Prague, United Arab Emirates University, Tokyo City University, Princeton Plasma Physics Laboratory, The University of Texas at Dallas, Key Laboratory of Materials Modification by Laser, Ion, and Electron Beams (Ministry of Education), School of Physics, Dalian University of Technology, Department of Electrical Engineering, Hanyang University, Department of Physics & Biophysics, University of San Diego, Lynntech Inc., Honeybee Robotics, Ltd, NASA Jet Propulsion Laboratory, Texas A\&M University, The University of Tokyo, Nihon University, Kyushu University, National Institute for Basic Biology, National Institute for Fusion Science, Loma Linda University, Division of Infection Prevention and Control, Tokyo healthcare university, FIRST, Tokyo Institute of Technology, Pohang University of Science and Technology, Masaryk University, Brno, Czech Republic, Institute of Plasma Physics, CAS, Prague, Czech Republic, Michigan State Univ, Nagoya University, Nagoya Industries Promotion Corporation, Leibniz Institute for Plasma Science and Technology (INP), Meijo University, Samsung electronics, The university of texas at austin, Esgee Technologies Inc, Leuphana University Lüneburg, ITER-India, Institute for Plasma Research (IPR), Gandhinagar, India, 382428, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, 382007, Ulsan National Institute of Science and Technology, University of Wisconsin - Madison, Texas Tech Univ, Lubbock, TX, Kinema Research, Colorado, SRC Triniti, Russia, CERN, RD51 Collaboration, IPFN/IST-UTL, Portugal, TRINITI, Los Alamos National Laboratory, Drexel University, Advanced Research Center for Nanolithography, University of Kentucky, Illinois Wesleyan University, Applied Materials, Inc., The University of Texas at Austin, Esgee Technologies Inc., Tokyo Electron America, Inc., Samsung Electronics Mechatronics Division, PIIM, Aix-Marseille University, France, University of York, UK, LSPM, Universit\'e Paris 13, France, Curtin University, University of Surrey, Gifu University, Chiba Institute of Technology, Dublin City University, Ireland, Teagasc, Ireland, Chevron Energy Technology Company, USA, Texas A&M University Department of Mechanical Engineering, Plasma Engineering and Non-equilibrium Processing Laboratory at Texas A\&M University, National Center for Electron Beam Research at Texas A\&M University, Sandia National Laboratories, Hanyang University, Korea Research Institute of Standards and Science, Korea Research Institute of Standards and Science, Chungnam National University, Hungarian Academy of Sciences, Hungarian Academy of Sciences, West Virginia University, Ruhr-University Bochum, West Virginia University, V.N. Karazin Kharkiv National University, Wigner Research Centre for Physics, Ruhr-University, West Virginia University; Ruhr-University, Wigner Research Centre for Physics; West Virginia University, Dalian University of Technology, China, University of Houston, USA, University of California, USA, CEA/CESTA, Tokyo Institute of Technology, Leibniz Institute for Plasma Science and Technology, Greifswald, Germany, University of Cambridge, Stanford University, Mechanical Engineering Department, Stanford University, LAPLACE Laboratory, Toulouse, France, Princeton Plasma Physics Laboratory, Princeton, New Jersey, USA, University of Saskatchewan, Saskatoon, Canada, Institute of Physics, National Academy of Sciences of Ukraine, Institute of Semiconductor Physics, National Academy of Sciences of Ukraine, Princeton University, Metro Laser Co, IPFN/IST-UL, University of South Carolina, York Plasma Institute, Department of Physics, University of York, York, YO10 5DD, U.K., Leibniz Institute for Plasma Science and Technology (INP), 17489 Greifswald, Germany, LAPLACE, CNRS and Univ. Toulouse III, France, Stockholm University, Swansea University, Dalian Maritime University, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, LTEOil LLC, Department of Mechanical Engineering, Texas A\&M University, College Station, Osaka City University, qfan@egr.msu.edu, Department of Electrical Engineering and Information Science, Ruhr-University Bochum, Germany, Institute for Solid State Physics and Optics, Wigner Research Centre for Physics, Hungarian Academy of Sciences, Budapest, Hungary, PlasmaPotential—Physics Consulting and Research, Canberra, Australia, University of Notre Dame, Chungnam National University, Chungnam National University, Nanotech Optoelectronics Research Center, Samsung Electronics Co., Ltd., Laboratoire de physique des plasmas, Ecole Polytechnique, centre de mathematiques appliques, Xi'an Jiaotong University, Ferdinand Braun Institute Berlin, Texas A/&M University
Sergey Leonov

Naval Research Laboratory, Washington, DC 20375, Applied Materials Inc, Grad. School of Eng., Tohoku University, Graduate School of Engineering, Tohoku University, Retired, Dalian University of Technology, Michigan State University, Texas A&M University, Teagasc, Dublin City University, GREMI, University of Orleans, Polytech Orleans, University of Orleans, Kyoto Institute of Technology, Eindhoven University of Technology, VDL Enabling Technologies Group, Ruhr-University Bochum, Leuphana University Luneburg, North Carolina State University, Applied Materials Inc., Tokyo Metropolitan University, Hokkaido University, LPP and LPICM, CNRS, Ecole Polytechnique,Tu/e, The Netherlands, CWI Amsterdam and Eindhoven Univ Techn, Oak Ridge National Laboratory, Idaho National Laboratory, School of Physics, Huazhong University of Science and Technology, Wuhan 430074, China, Princeton Plasma Physics Laboratory, Princeton University, Princeton, New Jersy 08543, USA, ITER-India, IPR, Gandhinagar, India, 382428, DA-IICT, Gandhinagar, India, 382007, Samsung Electronics Co., US Army SMDC/Army Forces Strategic Command, UAH Systems Management and Production Center, University of Alabama in Huntsville, Moscow Institute of Physics and Technology, CNRS Institut Pprime, University of Poitiers, CNRS, Ecole Polytechnique, Samsung Electronics Company, Ltd., Ruhr University Bochum, LPGP CNRS Univ. Paris-Sud Univ. Paris-Saclay, LSPM CNRS UPR 3407 UNIV. PARIS 13 SORBONNE PARIS CITE, Missouri University of Science and Technology, Tblisi State University, ELI Prague, United Arab Emirates University, Tokyo City University, Princeton Plasma Physics Laboratory, The University of Texas at Dallas, Key Laboratory of Materials Modification by Laser, Ion, and Electron Beams (Ministry of Education), School of Physics, Dalian University of Technology, Department of Electrical Engineering, Hanyang University, Department of Physics & Biophysics, University of San Diego, Lynntech Inc., Honeybee Robotics, Ltd, NASA Jet Propulsion Laboratory, Texas A\&M University, The University of Tokyo, Nihon University, Kyushu University, National Institute for Basic Biology, National Institute for Fusion Science, Loma Linda University, Division of Infection Prevention and Control, Tokyo healthcare university, FIRST, Tokyo Institute of Technology, Pohang University of Science and Technology, Masaryk University, Brno, Czech Republic, Institute of Plasma Physics, CAS, Prague, Czech Republic, Michigan State Univ, Nagoya University, Nagoya Industries Promotion Corporation, Leibniz Institute for Plasma Science and Technology (INP), Meijo University, Samsung electronics, The university of texas at austin, Esgee Technologies Inc, Leuphana University Lüneburg, ITER-India, Institute for Plasma Research (IPR), Gandhinagar, India, 382428, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, 382007, Ulsan National Institute of Science and Technology, University of Wisconsin - Madison, Texas Tech Univ, Lubbock, TX, Kinema Research, Colorado, SRC Triniti, Russia, CERN, RD51 Collaboration, IPFN/IST-UTL, Portugal, TRINITI, Los Alamos National Laboratory, Drexel University, Advanced Research Center for Nanolithography, University of Kentucky, Illinois Wesleyan University, Applied Materials, Inc., The University of Texas at Austin, Esgee Technologies Inc., Tokyo Electron America, Inc., Samsung Electronics Mechatronics Division, PIIM, Aix-Marseille University, France, University of York, UK, LSPM, Universit\'e Paris 13, France, Curtin University, University of Surrey, Gifu University, Chiba Institute of Technology, Dublin City University, Ireland, Teagasc, Ireland, Chevron Energy Technology Company, USA, Texas A&M University Department of Mechanical Engineering, Plasma Engineering and Non-equilibrium Processing Laboratory at Texas A\&M University, National Center for Electron Beam Research at Texas A\&M University, Sandia National Laboratories, Hanyang University, Korea Research Institute of Standards and Science, Korea Research Institute of Standards and Science, Chungnam National University, Hungarian Academy of Sciences, Hungarian Academy of Sciences, West Virginia University, Ruhr-University Bochum, West Virginia University, V.N. Karazin Kharkiv National University, Wigner Research Centre for Physics, Ruhr-University, West Virginia University; Ruhr-University, Wigner Research Centre for Physics; West Virginia University, Dalian University of Technology, China, University of Houston, USA, University of California, USA, CEA/CESTA, Tokyo Institute of Technology, Leibniz Institute for Plasma Science and Technology, Greifswald, Germany, University of Cambridge, Stanford University, Mechanical Engineering Department, Stanford University, LAPLACE Laboratory, Toulouse, France, Princeton Plasma Physics Laboratory, Princeton, New Jersey, USA, University of Saskatchewan, Saskatoon, Canada, Institute of Physics, National Academy of Sciences of Ukraine, Institute of Semiconductor Physics, National Academy of Sciences of Ukraine, Princeton University, Metro Laser Co, IPFN/IST-UL, University of South Carolina, York Plasma Institute, Department of Physics, University of York, York, YO10 5DD, U.K., Leibniz Institute for Plasma Science and Technology (INP), 17489 Greifswald, Germany, LAPLACE, CNRS and Univ. Toulouse III, France, Stockholm University, Swansea University, Dalian Maritime University, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, LTEOil LLC, Department of Mechanical Engineering, Texas A\&M University, College Station, Osaka City University, qfan@egr.msu.edu, Department of Electrical Engineering and Information Science, Ruhr-University Bochum, Germany, Institute for Solid State Physics and Optics, Wigner Research Centre for Physics, Hungarian Academy of Sciences, Budapest, Hungary, PlasmaPotential—Physics Consulting and Research, Canberra, Australia, University of Notre Dame, Chungnam National University, Chungnam National University, Nanotech Optoelectronics Research Center, Samsung Electronics Co., Ltd., Laboratoire de physique des plasmas, Ecole Polytechnique, centre de mathematiques appliques, Xi'an Jiaotong University, Ferdinand Braun Institute Berlin, Texas A/&M University
Sergey Leonov

Naval Research Laboratory, Washington, DC 20375, Applied Materials Inc, Grad. School of Eng., Tohoku University, Graduate School of Engineering, Tohoku University, Retired, Dalian University of Technology, Michigan State University, Texas A&M University, Teagasc, Dublin City University, GREMI, University of Orleans, Polytech Orleans, University of Orleans, Kyoto Institute of Technology, Eindhoven University of Technology, VDL Enabling Technologies Group, Ruhr-University Bochum, Leuphana University Luneburg, North Carolina State University, Applied Materials Inc., Tokyo Metropolitan University, Hokkaido University, LPP and LPICM, CNRS, Ecole Polytechnique,Tu/e, The Netherlands, CWI Amsterdam and Eindhoven Univ Techn, Oak Ridge National Laboratory, Idaho National Laboratory, School of Physics, Huazhong University of Science and Technology, Wuhan 430074, China, Princeton Plasma Physics Laboratory, Princeton University, Princeton, New Jersy 08543, USA, ITER-India, IPR, Gandhinagar, India, 382428, DA-IICT, Gandhinagar, India, 382007, Samsung Electronics Co., US Army SMDC/Army Forces Strategic Command, UAH Systems Management and Production Center, University of Alabama in Huntsville, Moscow Institute of Physics and Technology, CNRS Institut Pprime, University of Poitiers, CNRS, Ecole Polytechnique, Samsung Electronics Company, Ltd., Ruhr University Bochum, LPGP CNRS Univ. Paris-Sud Univ. Paris-Saclay, LSPM CNRS UPR 3407 UNIV. PARIS 13 SORBONNE PARIS CITE, Missouri University of Science and Technology, Tblisi State University, ELI Prague, United Arab Emirates University, Tokyo City University, Princeton Plasma Physics Laboratory, The University of Texas at Dallas, Key Laboratory of Materials Modification by Laser, Ion, and Electron Beams (Ministry of Education), School of Physics, Dalian University of Technology, Department of Electrical Engineering, Hanyang University, Department of Physics & Biophysics, University of San Diego, Lynntech Inc., Honeybee Robotics, Ltd, NASA Jet Propulsion Laboratory, Texas A\&M University, The University of Tokyo, Nihon University, Kyushu University, National Institute for Basic Biology, National Institute for Fusion Science, Loma Linda University, Division of Infection Prevention and Control, Tokyo healthcare university, FIRST, Tokyo Institute of Technology, Pohang University of Science and Technology, Masaryk University, Brno, Czech Republic, Institute of Plasma Physics, CAS, Prague, Czech Republic, Michigan State Univ, Nagoya University, Nagoya Industries Promotion Corporation, Leibniz Institute for Plasma Science and Technology (INP), Meijo University, Samsung electronics, The university of texas at austin, Esgee Technologies Inc, Leuphana University Lüneburg, ITER-India, Institute for Plasma Research (IPR), Gandhinagar, India, 382428, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, 382007, Ulsan National Institute of Science and Technology, University of Wisconsin - Madison, Texas Tech Univ, Lubbock, TX, Kinema Research, Colorado, SRC Triniti, Russia, CERN, RD51 Collaboration, IPFN/IST-UTL, Portugal, TRINITI, Los Alamos National Laboratory, Drexel University, Advanced Research Center for Nanolithography, University of Kentucky, Illinois Wesleyan University, Applied Materials, Inc., The University of Texas at Austin, Esgee Technologies Inc., Tokyo Electron America, Inc., Samsung Electronics Mechatronics Division, PIIM, Aix-Marseille University, France, University of York, UK, LSPM, Universit\'e Paris 13, France, Curtin University, University of Surrey, Gifu University, Chiba Institute of Technology, Dublin City University, Ireland, Teagasc, Ireland, Chevron Energy Technology Company, USA, Texas A&M University Department of Mechanical Engineering, Plasma Engineering and Non-equilibrium Processing Laboratory at Texas A\&M University, National Center for Electron Beam Research at Texas A\&M University, Sandia National Laboratories, Hanyang University, Korea Research Institute of Standards and Science, Korea Research Institute of Standards and Science, Chungnam National University, Hungarian Academy of Sciences, Hungarian Academy of Sciences, West Virginia University, Ruhr-University Bochum, West Virginia University, V.N. Karazin Kharkiv National University, Wigner Research Centre for Physics, Ruhr-University, West Virginia University; Ruhr-University, Wigner Research Centre for Physics; West Virginia University, Dalian University of Technology, China, University of Houston, USA, University of California, USA, CEA/CESTA, Tokyo Institute of Technology, Leibniz Institute for Plasma Science and Technology, Greifswald, Germany, University of Cambridge, Stanford University, Mechanical Engineering Department, Stanford University, LAPLACE Laboratory, Toulouse, France, Princeton Plasma Physics Laboratory, Princeton, New Jersey, USA, University of Saskatchewan, Saskatoon, Canada, Institute of Physics, National Academy of Sciences of Ukraine, Institute of Semiconductor Physics, National Academy of Sciences of Ukraine, Princeton University, Metro Laser Co, IPFN/IST-UL, University of South Carolina, York Plasma Institute, Department of Physics, University of York, York, YO10 5DD, U.K., Leibniz Institute for Plasma Science and Technology (INP), 17489 Greifswald, Germany, LAPLACE, CNRS and Univ. Toulouse III, France, Stockholm University, Swansea University, Dalian Maritime University, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, LTEOil LLC, Department of Mechanical Engineering, Texas A\&M University, College Station, Osaka City University, qfan@egr.msu.edu, Department of Electrical Engineering and Information Science, Ruhr-University Bochum, Germany, Institute for Solid State Physics and Optics, Wigner Research Centre for Physics, Hungarian Academy of Sciences, Budapest, Hungary, PlasmaPotential—Physics Consulting and Research, Canberra, Australia, University of Notre Dame, Chungnam National University, Chungnam National University, Nanotech Optoelectronics Research Center, Samsung Electronics Co., Ltd., Laboratoire de physique des plasmas, Ecole Polytechnique, centre de mathematiques appliques, Xi'an Jiaotong University, Ferdinand Braun Institute Berlin, Texas A/&M University