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The effect of temperature on electron recombination with water and hydrocarbon ions in high-voltage nanosecond discharge afterglow

POSTER

Abstract

The results of the experimental and numerical study of high-voltage nanosecond discharge plasma decay in gaseous H2O:N2 and H2O:O2 mixtures and in ethane, propane and gas mixtures with them were presented for gas temperature from 300 to 630 K, electron temperature ranged from 300 to 25 000 K and pressures from 1 to 7 Torr. Time-resolved electron density during the plasma decay was measured with a microwave interferometer and effective recombination coefficients were obtained. Measured coefficients depend on gas and electron temperatures and on gas density. Numerical calculation of plasma decay was conducted using available data on recombination coefficients and calculated results were compared with measured ones. It was shown that plasma decay in room temperature gases is controlled by dissociative electron recombination with positive cluster ions.

Authors

  • Andrey Starikovskiy

    Princeton University

  • Sergey Leonov

    Naval Research Laboratory, Washington, DC 20375, Applied Materials Inc, Grad. School of Eng., Tohoku University, Graduate School of Engineering, Tohoku University, Retired, Dalian University of Technology, Michigan State University, Texas A&M University, Teagasc, Dublin City University, GREMI, University of Orleans, Polytech Orleans, University of Orleans, Kyoto Institute of Technology, Eindhoven University of Technology, VDL Enabling Technologies Group, Ruhr-University Bochum, Leuphana University Luneburg, North Carolina State University, Applied Materials Inc., Tokyo Metropolitan University, Hokkaido University, LPP and LPICM, CNRS, Ecole Polytechnique,Tu/e, The Netherlands, CWI Amsterdam and Eindhoven Univ Techn, Oak Ridge National Laboratory, Idaho National Laboratory, School of Physics, Huazhong University of Science and Technology, Wuhan 430074, China, Princeton Plasma Physics Laboratory, Princeton University, Princeton, New Jersy 08543, USA, ITER-India, IPR, Gandhinagar, India, 382428, DA-IICT, Gandhinagar, India, 382007, Samsung Electronics Co., US Army SMDC/Army Forces Strategic Command, UAH Systems Management and Production Center, University of Alabama in Huntsville, Moscow Institute of Physics and Technology, CNRS Institut Pprime, University of Poitiers, CNRS, Ecole Polytechnique, Samsung Electronics Company, Ltd., Ruhr University Bochum, LPGP CNRS Univ. Paris-Sud Univ. Paris-Saclay, LSPM CNRS UPR 3407 UNIV. PARIS 13 SORBONNE PARIS CITE, Missouri University of Science and Technology, Tblisi State University, ELI Prague, United Arab Emirates University, Tokyo City University, Princeton Plasma Physics Laboratory, The University of Texas at Dallas, Key Laboratory of Materials Modification by Laser, Ion, and Electron Beams (Ministry of Education), School of Physics, Dalian University of Technology, Department of Electrical Engineering, Hanyang University, Department of Physics & Biophysics, University of San Diego, Lynntech Inc., Honeybee Robotics, Ltd, NASA Jet Propulsion Laboratory, Texas A\&M University, The University of Tokyo, Nihon University, Kyushu University, National Institute for Basic Biology, National Institute for Fusion Science, Loma Linda University, Division of Infection Prevention and Control, Tokyo healthcare university, FIRST, Tokyo Institute of Technology, Pohang University of Science and Technology, Masaryk University, Brno, Czech Republic, Institute of Plasma Physics, CAS, Prague, Czech Republic, Michigan State Univ, Nagoya University, Nagoya Industries Promotion Corporation, Leibniz Institute for Plasma Science and Technology (INP), Meijo University, Samsung electronics, The university of texas at austin, Esgee Technologies Inc, Leuphana University Lüneburg, ITER-India, Institute for Plasma Research (IPR), Gandhinagar, India, 382428, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, 382007, Ulsan National Institute of Science and Technology, University of Wisconsin - Madison, Texas Tech Univ, Lubbock, TX, Kinema Research, Colorado, SRC Triniti, Russia, CERN, RD51 Collaboration, IPFN/IST-UTL, Portugal, TRINITI, Los Alamos National Laboratory, Drexel University, Advanced Research Center for Nanolithography, University of Kentucky, Illinois Wesleyan University, Applied Materials, Inc., The University of Texas at Austin, Esgee Technologies Inc., Tokyo Electron America, Inc., Samsung Electronics Mechatronics Division, PIIM, Aix-Marseille University, France, University of York, UK, LSPM, Universit\'e Paris 13, France, Curtin University, University of Surrey, Gifu University, Chiba Institute of Technology, Dublin City University, Ireland, Teagasc, Ireland, Chevron Energy Technology Company, USA, Texas A&M University Department of Mechanical Engineering, Plasma Engineering and Non-equilibrium Processing Laboratory at Texas A\&M University, National Center for Electron Beam Research at Texas A\&M University, Sandia National Laboratories, Hanyang University, Korea Research Institute of Standards and Science, Korea Research Institute of Standards and Science, Chungnam National University, Hungarian Academy of Sciences, Hungarian Academy of Sciences, West Virginia University, Ruhr-University Bochum, West Virginia University, V.N. Karazin Kharkiv National University, Wigner Research Centre for Physics, Ruhr-University, West Virginia University; Ruhr-University, Wigner Research Centre for Physics; West Virginia University, Dalian University of Technology, China, University of Houston, USA, University of California, USA, CEA/CESTA, Tokyo Institute of Technology, Leibniz Institute for Plasma Science and Technology, Greifswald, Germany, University of Cambridge, Stanford University, Mechanical Engineering Department, Stanford University, LAPLACE Laboratory, Toulouse, France, Princeton Plasma Physics Laboratory, Princeton, New Jersey, USA, University of Saskatchewan, Saskatoon, Canada, Institute of Physics, National Academy of Sciences of Ukraine, Institute of Semiconductor Physics, National Academy of Sciences of Ukraine, Princeton University, Metro Laser Co, IPFN/IST-UL, University of South Carolina, York Plasma Institute, Department of Physics, University of York, York, YO10 5DD, U.K., Leibniz Institute for Plasma Science and Technology (INP), 17489 Greifswald, Germany, LAPLACE, CNRS and Univ. Toulouse III, France, Stockholm University, Swansea University, Dalian Maritime University, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, LTEOil LLC, Department of Mechanical Engineering, Texas A\&M University, College Station, Osaka City University, qfan@egr.msu.edu, Department of Electrical Engineering and Information Science, Ruhr-University Bochum, Germany, Institute for Solid State Physics and Optics, Wigner Research Centre for Physics, Hungarian Academy of Sciences, Budapest, Hungary, PlasmaPotential—Physics Consulting and Research, Canberra, Australia, University of Notre Dame, Chungnam National University, Chungnam National University, Nanotech Optoelectronics Research Center, Samsung Electronics Co., Ltd., Laboratoire de physique des plasmas, Ecole Polytechnique, centre de mathematiques appliques, Xi'an Jiaotong University, Ferdinand Braun Institute Berlin, Texas A/&M University

  • Sergey Leonov

    Naval Research Laboratory, Washington, DC 20375, Applied Materials Inc, Grad. School of Eng., Tohoku University, Graduate School of Engineering, Tohoku University, Retired, Dalian University of Technology, Michigan State University, Texas A&M University, Teagasc, Dublin City University, GREMI, University of Orleans, Polytech Orleans, University of Orleans, Kyoto Institute of Technology, Eindhoven University of Technology, VDL Enabling Technologies Group, Ruhr-University Bochum, Leuphana University Luneburg, North Carolina State University, Applied Materials Inc., Tokyo Metropolitan University, Hokkaido University, LPP and LPICM, CNRS, Ecole Polytechnique,Tu/e, The Netherlands, CWI Amsterdam and Eindhoven Univ Techn, Oak Ridge National Laboratory, Idaho National Laboratory, School of Physics, Huazhong University of Science and Technology, Wuhan 430074, China, Princeton Plasma Physics Laboratory, Princeton University, Princeton, New Jersy 08543, USA, ITER-India, IPR, Gandhinagar, India, 382428, DA-IICT, Gandhinagar, India, 382007, Samsung Electronics Co., US Army SMDC/Army Forces Strategic Command, UAH Systems Management and Production Center, University of Alabama in Huntsville, Moscow Institute of Physics and Technology, CNRS Institut Pprime, University of Poitiers, CNRS, Ecole Polytechnique, Samsung Electronics Company, Ltd., Ruhr University Bochum, LPGP CNRS Univ. Paris-Sud Univ. Paris-Saclay, LSPM CNRS UPR 3407 UNIV. PARIS 13 SORBONNE PARIS CITE, Missouri University of Science and Technology, Tblisi State University, ELI Prague, United Arab Emirates University, Tokyo City University, Princeton Plasma Physics Laboratory, The University of Texas at Dallas, Key Laboratory of Materials Modification by Laser, Ion, and Electron Beams (Ministry of Education), School of Physics, Dalian University of Technology, Department of Electrical Engineering, Hanyang University, Department of Physics & Biophysics, University of San Diego, Lynntech Inc., Honeybee Robotics, Ltd, NASA Jet Propulsion Laboratory, Texas A\&M University, The University of Tokyo, Nihon University, Kyushu University, National Institute for Basic Biology, National Institute for Fusion Science, Loma Linda University, Division of Infection Prevention and Control, Tokyo healthcare university, FIRST, Tokyo Institute of Technology, Pohang University of Science and Technology, Masaryk University, Brno, Czech Republic, Institute of Plasma Physics, CAS, Prague, Czech Republic, Michigan State Univ, Nagoya University, Nagoya Industries Promotion Corporation, Leibniz Institute for Plasma Science and Technology (INP), Meijo University, Samsung electronics, The university of texas at austin, Esgee Technologies Inc, Leuphana University Lüneburg, ITER-India, Institute for Plasma Research (IPR), Gandhinagar, India, 382428, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, 382007, Ulsan National Institute of Science and Technology, University of Wisconsin - Madison, Texas Tech Univ, Lubbock, TX, Kinema Research, Colorado, SRC Triniti, Russia, CERN, RD51 Collaboration, IPFN/IST-UTL, Portugal, TRINITI, Los Alamos National Laboratory, Drexel University, Advanced Research Center for Nanolithography, University of Kentucky, Illinois Wesleyan University, Applied Materials, Inc., The University of Texas at Austin, Esgee Technologies Inc., Tokyo Electron America, Inc., Samsung Electronics Mechatronics Division, PIIM, Aix-Marseille University, France, University of York, UK, LSPM, Universit\'e Paris 13, France, Curtin University, University of Surrey, Gifu University, Chiba Institute of Technology, Dublin City University, Ireland, Teagasc, Ireland, Chevron Energy Technology Company, USA, Texas A&M University Department of Mechanical Engineering, Plasma Engineering and Non-equilibrium Processing Laboratory at Texas A\&M University, National Center for Electron Beam Research at Texas A\&M University, Sandia National Laboratories, Hanyang University, Korea Research Institute of Standards and Science, Korea Research Institute of Standards and Science, Chungnam National University, Hungarian Academy of Sciences, Hungarian Academy of Sciences, West Virginia University, Ruhr-University Bochum, West Virginia University, V.N. Karazin Kharkiv National University, Wigner Research Centre for Physics, Ruhr-University, West Virginia University; Ruhr-University, Wigner Research Centre for Physics; West Virginia University, Dalian University of Technology, China, University of Houston, USA, University of California, USA, CEA/CESTA, Tokyo Institute of Technology, Leibniz Institute for Plasma Science and Technology, Greifswald, Germany, University of Cambridge, Stanford University, Mechanical Engineering Department, Stanford University, LAPLACE Laboratory, Toulouse, France, Princeton Plasma Physics Laboratory, Princeton, New Jersey, USA, University of Saskatchewan, Saskatoon, Canada, Institute of Physics, National Academy of Sciences of Ukraine, Institute of Semiconductor Physics, National Academy of Sciences of Ukraine, Princeton University, Metro Laser Co, IPFN/IST-UL, University of South Carolina, York Plasma Institute, Department of Physics, University of York, York, YO10 5DD, U.K., Leibniz Institute for Plasma Science and Technology (INP), 17489 Greifswald, Germany, LAPLACE, CNRS and Univ. Toulouse III, France, Stockholm University, Swansea University, Dalian Maritime University, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, LTEOil LLC, Department of Mechanical Engineering, Texas A\&M University, College Station, Osaka City University, qfan@egr.msu.edu, Department of Electrical Engineering and Information Science, Ruhr-University Bochum, Germany, Institute for Solid State Physics and Optics, Wigner Research Centre for Physics, Hungarian Academy of Sciences, Budapest, Hungary, PlasmaPotential—Physics Consulting and Research, Canberra, Australia, University of Notre Dame, Chungnam National University, Chungnam National University, Nanotech Optoelectronics Research Center, Samsung Electronics Co., Ltd., Laboratoire de physique des plasmas, Ecole Polytechnique, centre de mathematiques appliques, Xi'an Jiaotong University, Ferdinand Braun Institute Berlin, Texas A/&M University

  • Sergey Leonov

    Naval Research Laboratory, Washington, DC 20375, Applied Materials Inc, Grad. School of Eng., Tohoku University, Graduate School of Engineering, Tohoku University, Retired, Dalian University of Technology, Michigan State University, Texas A&M University, Teagasc, Dublin City University, GREMI, University of Orleans, Polytech Orleans, University of Orleans, Kyoto Institute of Technology, Eindhoven University of Technology, VDL Enabling Technologies Group, Ruhr-University Bochum, Leuphana University Luneburg, North Carolina State University, Applied Materials Inc., Tokyo Metropolitan University, Hokkaido University, LPP and LPICM, CNRS, Ecole Polytechnique,Tu/e, The Netherlands, CWI Amsterdam and Eindhoven Univ Techn, Oak Ridge National Laboratory, Idaho National Laboratory, School of Physics, Huazhong University of Science and Technology, Wuhan 430074, China, Princeton Plasma Physics Laboratory, Princeton University, Princeton, New Jersy 08543, USA, ITER-India, IPR, Gandhinagar, India, 382428, DA-IICT, Gandhinagar, India, 382007, Samsung Electronics Co., US Army SMDC/Army Forces Strategic Command, UAH Systems Management and Production Center, University of Alabama in Huntsville, Moscow Institute of Physics and Technology, CNRS Institut Pprime, University of Poitiers, CNRS, Ecole Polytechnique, Samsung Electronics Company, Ltd., Ruhr University Bochum, LPGP CNRS Univ. Paris-Sud Univ. Paris-Saclay, LSPM CNRS UPR 3407 UNIV. PARIS 13 SORBONNE PARIS CITE, Missouri University of Science and Technology, Tblisi State University, ELI Prague, United Arab Emirates University, Tokyo City University, Princeton Plasma Physics Laboratory, The University of Texas at Dallas, Key Laboratory of Materials Modification by Laser, Ion, and Electron Beams (Ministry of Education), School of Physics, Dalian University of Technology, Department of Electrical Engineering, Hanyang University, Department of Physics & Biophysics, University of San Diego, Lynntech Inc., Honeybee Robotics, Ltd, NASA Jet Propulsion Laboratory, Texas A\&M University, The University of Tokyo, Nihon University, Kyushu University, National Institute for Basic Biology, National Institute for Fusion Science, Loma Linda University, Division of Infection Prevention and Control, Tokyo healthcare university, FIRST, Tokyo Institute of Technology, Pohang University of Science and Technology, Masaryk University, Brno, Czech Republic, Institute of Plasma Physics, CAS, Prague, Czech Republic, Michigan State Univ, Nagoya University, Nagoya Industries Promotion Corporation, Leibniz Institute for Plasma Science and Technology (INP), Meijo University, Samsung electronics, The university of texas at austin, Esgee Technologies Inc, Leuphana University Lüneburg, ITER-India, Institute for Plasma Research (IPR), Gandhinagar, India, 382428, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, 382007, Ulsan National Institute of Science and Technology, University of Wisconsin - Madison, Texas Tech Univ, Lubbock, TX, Kinema Research, Colorado, SRC Triniti, Russia, CERN, RD51 Collaboration, IPFN/IST-UTL, Portugal, TRINITI, Los Alamos National Laboratory, Drexel University, Advanced Research Center for Nanolithography, University of Kentucky, Illinois Wesleyan University, Applied Materials, Inc., The University of Texas at Austin, Esgee Technologies Inc., Tokyo Electron America, Inc., Samsung Electronics Mechatronics Division, PIIM, Aix-Marseille University, France, University of York, UK, LSPM, Universit\'e Paris 13, France, Curtin University, University of Surrey, Gifu University, Chiba Institute of Technology, Dublin City University, Ireland, Teagasc, Ireland, Chevron Energy Technology Company, USA, Texas A&M University Department of Mechanical Engineering, Plasma Engineering and Non-equilibrium Processing Laboratory at Texas A\&M University, National Center for Electron Beam Research at Texas A\&M University, Sandia National Laboratories, Hanyang University, Korea Research Institute of Standards and Science, Korea Research Institute of Standards and Science, Chungnam National University, Hungarian Academy of Sciences, Hungarian Academy of Sciences, West Virginia University, Ruhr-University Bochum, West Virginia University, V.N. Karazin Kharkiv National University, Wigner Research Centre for Physics, Ruhr-University, West Virginia University; Ruhr-University, Wigner Research Centre for Physics; West Virginia University, Dalian University of Technology, China, University of Houston, USA, University of California, USA, CEA/CESTA, Tokyo Institute of Technology, Leibniz Institute for Plasma Science and Technology, Greifswald, Germany, University of Cambridge, Stanford University, Mechanical Engineering Department, Stanford University, LAPLACE Laboratory, Toulouse, France, Princeton Plasma Physics Laboratory, Princeton, New Jersey, USA, University of Saskatchewan, Saskatoon, Canada, Institute of Physics, National Academy of Sciences of Ukraine, Institute of Semiconductor Physics, National Academy of Sciences of Ukraine, Princeton University, Metro Laser Co, IPFN/IST-UL, University of South Carolina, York Plasma Institute, Department of Physics, University of York, York, YO10 5DD, U.K., Leibniz Institute for Plasma Science and Technology (INP), 17489 Greifswald, Germany, LAPLACE, CNRS and Univ. Toulouse III, France, Stockholm University, Swansea University, Dalian Maritime University, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, LTEOil LLC, Department of Mechanical Engineering, Texas A\&M University, College Station, Osaka City University, qfan@egr.msu.edu, Department of Electrical Engineering and Information Science, Ruhr-University Bochum, Germany, Institute for Solid State Physics and Optics, Wigner Research Centre for Physics, Hungarian Academy of Sciences, Budapest, Hungary, PlasmaPotential—Physics Consulting and Research, Canberra, Australia, University of Notre Dame, Chungnam National University, Chungnam National University, Nanotech Optoelectronics Research Center, Samsung Electronics Co., Ltd., Laboratoire de physique des plasmas, Ecole Polytechnique, centre de mathematiques appliques, Xi'an Jiaotong University, Ferdinand Braun Institute Berlin, Texas A/&M University