Stereovision-based Displacement Analysis on Adhesive Burst Test

Failure of adhesive hydrogels is a common phenomenon that is influenced by the mechanical properties of the adhesive and the interface. Burst tests, wherein internal pressure is applied to a defect on an airtight substrate that is sealed with an adhesive, is a common method to test adhesive/cohesive failure of hydrogel adhesives. However, traditional burst tests are limited to rudimentary pressure measurements at the point of adhesive failure (known as burst pressure), whereas deformation history and strain evolution of the adhesive and the substrate are usually ignored. In this contribution, we employ computer stereovision to capture the three-dimensional (3D) displacement profile of the adhesive and the substrate during deformation, which allows for obtaining pixelsize spatiotemporal deformation maps. These 3D maps enabled stress and strain analysis and indicated their buildup until the point of adhesive failure. The modified burst pressure test described here is then proposed to analyze the bursting of various adhesives and surface types. This methodology is proposed as a cost-effective and rapid assessment screening tool to test the performance of adhesives and coatings.