Preparation of NbN-AlN-NbN Josephson junctions by atomic layer deposition
ORAL
Abstract
Josephson junctions, as the cornerstone of superconducting quantum computing, are extensively studied across various material platforms. Among these, Al/AlOx/Al junctions are widely used due to their well-established fabrication techniques. However, these junctions are susceptible to two-level-system losses in the AlOx barrier and are limited by the low transition temperature of aluminum. In this work, we employ a novel trilayer thin film, NbN/AlN/NbN, grown by atomic layer deposition, to make junctions for applications at temperatures exceeding 1K. A flip-chip technique is utilized to simplify fabrication and minimize damage during processing. Preliminary current-voltage characteristics of junctions across multiple wafers will be presented in the talk.
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Presenters
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Danqing Wang
Yale University
Authors
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Danqing Wang
Yale University
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Chengxing He
Yale University
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Charlotte Boettcher
Yale University
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Yufeng Wu
Yale University
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Chunzhen Li
Yale University
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Hong X Tang
Yale University