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Preparation of NbN-AlN-NbN Josephson junctions by atomic layer deposition

ORAL

Abstract

Josephson junctions, as the cornerstone of superconducting quantum computing, are extensively studied across various material platforms. Among these, Al/AlOx/Al junctions are widely used due to their well-established fabrication techniques. However, these junctions are susceptible to two-level-system losses in the AlOx barrier and are limited by the low transition temperature of aluminum. In this work, we employ a novel trilayer thin film, NbN/AlN/NbN, grown by atomic layer deposition, to make junctions for applications at temperatures exceeding 1K. A flip-chip technique is utilized to simplify fabrication and minimize damage during processing. Preliminary current-voltage characteristics of junctions across multiple wafers will be presented in the talk.

Presenters

  • Danqing Wang

    Yale University

Authors

  • Danqing Wang

    Yale University

  • Chengxing He

    Yale University

  • Charlotte Boettcher

    Yale University

  • Yufeng Wu

    Yale University

  • Chunzhen Li

    Yale University

  • Hong X Tang

    Yale University