Superconducting Integration, Packaging & Validation
FOCUS · MAR-B18 · ID: 3105503
Presentations
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3D-Integrated Superconducting Qubits: CMOS-Compatible, Wafer-Scale Processing for Flip-Chip Architectures
ORAL
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Presenters
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Thomas Mayer
Fraunhofer EMFT
Authors
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Thomas Mayer
Fraunhofer EMFT
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Hannes Bender
Fraunhofer EMFT
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Simon Lang
Fraunhofer EMFT
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Luis Schwarzenbach
Fraunhofer EMFT
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Waltraud Hell
Fraunhofer EMFT
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Johannes Weber
Fraunhofer EMFT
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Carla Morán Guizán
Fraunhofer EMFT
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Chawki Dhieb
Fraunhofer EMFT
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Daniela Zahn
Fraunhofer EMFT
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Zhen Luo
Technical University of Munich (TUM), Fraunhofer EMFT, TU Munich
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Mihail Andronic
Fraunhofer EMFT
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Armin Klumpp
Fraunhofer EMFT
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Andreas Drost
Fraunhofer EMFT
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Karl Neumeier
Fraunhofer EMFT
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Wilfried Lerch
Fraunhofer EMFT
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Lars Nebrich
Fraunhofer EMFT
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Ignaz Eisele
Fraunhofer EMFT
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Rui N Pereira
Fraunhofer EMFT
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Christoph Kutter
Fraunhofer EMFT
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Scalable path towards 3D integration of superconducting qubits using advanced 300mm foundry manufacturing capabilities
ORAL
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Presenters
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A. M. Vadiraj
IMEC, imec
Authors
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A. M. Vadiraj
IMEC, imec
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Rohith Acharya
Katholieke University Leuven, IMEC, imec
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Anton Potočnik
imec
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Anish Dangol
imec
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Jaber Derakhshandeh
imec
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Shana Massar
IMEC, imec
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Maël Demarets
KU Leuven, IMEC, KU Leuven, imec
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Jacques Van Damme
IMEC, KU Leuven, imec
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Daniel Perez Lozano
imec
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Tsvetan Ivanov
IMEC, imec
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Yann Canvel
IMEC, imec
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Adham Elshaer
imec
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Punith Mudigere Krishne Gowda
imec
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Ehsan Shafahian
imec
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Bensu Tunca Altintas
imec
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Massimo Mongillo
IMEC, imec
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Danny Wan
IMEC, imec
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Kristiaan DeGreve
IMEC, IMEC, KU Leuven, imec, KU Leuven, imec
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Characterizing superconducting airbridges fabricated using a grayscale electron-beam lithography process
ORAL
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Presenters
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Prakiran Baidya
Friedrich-Alexander University Erlangen-Nürnberg, Friedrich-Alexander-Universität Erlangen-Nürnberg
Authors
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Prakiran Baidya
Friedrich-Alexander University Erlangen-Nürnberg, Friedrich-Alexander-Universität Erlangen-Nürnberg
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Momčilo Milosavljevic
Friedrich-Alexander University Erlangen-Nürnberg, Friedrich-Alexander-Universität Erlangen-Nürnberg
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Murali Krishna KURMAPU
Friedrich-Alexander University Erlangen-Nuremberg
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Victor Kemme
Friedrich-Alexander University Erlangen-Nürnberg, Friedrich-Alexander-Universität Erlangen-Nürnberg
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Thomas Fösel
Friedrich-Alexander University Erlangen-Nürnberg, Friedrich-Alexander University Erlangen-Nuremberg, Friedrich-Alexander-Universität Erlangen-Nürnberg
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Christopher Eichler
Friedrich-Alexander University Erlangen-Nuremberg
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Fabrication of Low-Loss Niobium Air Bridges for Superconducting Qubit Applications
ORAL
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Presenters
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Niklas Bruckmoser
Walther-Meissner-Institute, TU Munich, TUM
Authors
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Niklas Bruckmoser
Walther-Meissner-Institute, TU Munich, TUM
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Leon Koch
TU Munich
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Ivan Tsitsilin
TU Munich
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David Bunch
Walther-Meißner-Institute, TU Munich
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Lea Richard
Walther-Meißner-Institute, TU Munich
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Kedar E Honasoge
Walther-Meißner-Institut, Walther-Meißner-Institut, Technical University Munich, Walther-Meißner-Institut; Technical University of Munich, Walther Meissner Inst, TU Munich
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Thomas Luschmann
Walther Meissner Inst, TU Munich
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Maria-Teresa Handschuh
Walther-Meißner-Institut, Walther-Meißner-Institut, Technical University Munich, Walther-Meißner-Institut; Technical University of Munich, TU Munich
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Lasse Soedergren
Walther-Meißner-Institute, TU Munich, TUM
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Vera Bader
Walther-Meißner-Institut, TU Munich
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Christian Schneider
Walther-Meissner-Institute, TU Munich & Walther-Meißner-Institut, TU Munich, Walther-Meißner-Institut, Bayerische Akademie der Wissenschaften, 85748 Garching, Walther-Meißner-Institute, TUM
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Max Werninghaus
TU Munich, TU Munich, Walther-Meißner-Institute
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Stefan Filipp
TU Munich, TU Munich, Walther-Meißner-Institute
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Influence of scaling up technologies on transmon coherence
ORAL
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Presenters
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Leon Koch
TU Munich
Authors
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Leon Koch
TU Munich
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Niklas Bruckmoser
Walther-Meissner-Institute, TU Munich, TUM
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Lea Richard
Walther-Meißner-Institute, TU Munich
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David Bunch
Walther-Meißner-Institute, TU Munich
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Ivan Tsitsilin
TU Munich
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Kedar E Honasoge
Walther-Meißner-Institut, Walther-Meißner-Institut, Technical University Munich, Walther-Meißner-Institut; Technical University of Munich, Walther Meissner Inst, TU Munich
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Maria Handschuh
Walther-Meißner-Institute
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Lasse Soedergren
Walther-Meißner-Institute, TU Munich, TUM
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Vera Bader
Walther-Meißner-Institut, TU Munich
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Christian Schneider
Walther-Meissner-Institute, TU Munich & Walther-Meißner-Institut, TU Munich, Walther-Meißner-Institut, Bayerische Akademie der Wissenschaften, 85748 Garching, Walther-Meißner-Institute, TUM
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Max Werninghaus
TU Munich, TU Munich, Walther-Meißner-Institute
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Stefan Filipp
TU Munich, TU Munich, Walther-Meißner-Institute
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Surface participation and dielectric loss in flipchip superconducting qubits
ORAL
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Presenters
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YEN-AN SHIH
Delft University of Technology
Authors
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YEN-AN SHIH
Delft University of Technology
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siddharth singh
Delft University of Technology
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Rebecca Gharibaan
Delft University of Technology
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Nataliia Zhurbina
Delft University of Technology
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Lukas J Splitthoff
Chalmers University of Technology, Delft University of Technology
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Taryn Victoria Stefanski
University of Bristol
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Christian Kraglund Andersen
Delft University of Technology
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Efficient Routing and Interconnects for Superconducting Qubits
ORAL · Invited
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Publication: R. N. Das et al., "Reworkable Superconducting Qubit Package for Quantum Computing," 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, CO, USA, 2024, pp. 427-432.<br>Yost, D.R.W., Schwartz, M.E., Mallek, J. et al. Solid-state qubits integrated with superconducting through-silicon vias. npj Quantum Inf 6, 59 (2020).<br>D. Rosenberg et al., "Solid-State Qubits: 3D Integration and Packaging," in IEEE Microwave Magazine, vol. 21, no. 8, pp. 72-85, Aug. 2020.
Presenters
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Mollie E Schwartz
MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology
Authors
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Mollie E Schwartz
MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology
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Optimizing dielectric losses in a flip-chip architecture through silicon micromachining
ORAL
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Presenters
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Nicolas Zani
Yale University
Authors
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Nicolas Zani
Yale University
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Yanhao Wang
Yale University
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Suhas S Ganjam
Google LLC
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Archan Banerjee
Yale University
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Luigi Frunzio
Yale University
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Robert J Schoelkopf
Yale University
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Chip-to-chip superconducting liquid metal quantum connectors
ORAL
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Presenters
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Zhancheng Yao
Boston University
Authors
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Zhancheng Yao
Boston University
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Martin Sandberg
IBM Thomas J. Watson Research Center
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David W Abraham
IBM Thomas J. Watson Research Center
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David J Bishop
Boston University
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Liquid metal printing for superconducting circuits
ORAL
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Presenters
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Thomas Reisinger
Karlsruhe Institute of Technology
Authors
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Thomas Reisinger
Karlsruhe Institute of Technology
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Navid Hussain
Karlsruhe Institute of Technology
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Alexander Kreiner
Karlsruhe Institute of Technology
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Haoran Duan
Karlsruhe Institute of Technology
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Ritika Dhundhwal
Karlsruhe Institute of Technology
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Gabriel G Marques
Karlsruhe Institute of Technology
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Michael Hirtz
Karlsruhe Institute of Technology
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Ioan M. Pop
Karlsruhe Institute of Technology
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Jasmin Aghassi
Karlsruhe Institute of Technology
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Characterizing the impacts of sequential Josephson Junction fabrication on superconducting circuit performance
ORAL
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Presenters
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Duncan Miller
MIT Lincoln Laboratory
Authors
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Duncan Miller
MIT Lincoln Laboratory
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Bethany M Niedzielski
MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology
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Mallika T Randeria
MIT Lincoln Laboratory
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Hannah M Stickler
MIT Lincoln Laboratory
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David K Kim
MIT Lincoln Lab, Lincoln Laboratory, Massachusetts Institute of Technology
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Thomas M Hazard
MIT Lincoln Laboratory
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Michael Gingras
MIT Lincoln Laboratory
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Jeffrey M Knecht
MIT Lincoln Laboratory
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Kyle Serniak
MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology
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Cyrus F Hirjibehedin
MIT Lincoln Laboratory
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Jonilyn L Yoder
MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology
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Mollie E Schwartz
MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology
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Physical-Size Biasing Corrections for Improved Josephson Junction Targeting
ORAL
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Presenters
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Hannah M Stickler
MIT Lincoln Laboratory
Authors
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Hannah M Stickler
MIT Lincoln Laboratory
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Bethany M Niedzielski
MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology
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Michael Gingras
MIT Lincoln Laboratory
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Jeffrey M Knecht
MIT Lincoln Laboratory
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Kevin Grossklaus
MIT Lincoln Laboratories, MIT Lincoln Laboratory
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Kate Azar
Massachusetts Institute of Technology, MIT, MIT Lincoln Laboratory
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Renée DePencier Piñero
MIT Lincoln Laboratory, Lincoln Laboratory, MIT
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Greg Calusine
MIT Lincoln Laboratory
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Ali Sabbah
MIT Lincoln Laboratory
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Felipe Contipelli
MIT Lincoln Laboratory
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Duncan Miller
MIT Lincoln Laboratory
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Arthur Kurlej
MIT Lincoln Laboratory
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Jonilyn L Yoder
MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology
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Mollie E Schwartz
MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology
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William D Oliver
Massachusetts Institute of Technology, Massachusetts Institute of Technology (MIT)
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Kyle Serniak
MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology
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A Compact, Extensible, and Flexible Cable Solution for Superconducting Qubit
ORAL
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Presenters
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John Cummings
MIT Lincoln Laboratory
Authors
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John Cummings
MIT Lincoln Laboratory
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Xhovalin Miloshi
MIT Lincoln Laboratory
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Gabriel Cutter
Massachusetts Institute of Technology
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Steven J Weber
MIT Lincoln Laboratory
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Felipe Contipelli
MIT Lincoln Laboratory
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Renée D DePencier Piñero
MIT Lincoln Laboratory
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Michael Gingras
MIT Lincoln Laboratory
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Jennifer Hritz
MIT Lincoln Laboratory
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Madeline Morocco
MIT Lincoln Laboratory
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Bethany M Niedzielski
MIT Lincoln Laboratory
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Kyle Serniak
MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology
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Hannah M Stickler
MIT Lincoln Laboratory
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William D Oliver
Massachusetts Institute of Technology, Massachusetts Institute of Technology (MIT)
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Jonilyn L Yoder
MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology
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Cyrus F Hirjibehedin
MIT Lincoln Laboratory
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Mollie E Schwartz
MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology
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