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Superconducting Integration, Packaging & Validation

FOCUS · MAR-B18 · ID: 3105503







Presentations

  • 3D-Integrated Superconducting Qubits: CMOS-Compatible, Wafer-Scale Processing for Flip-Chip Architectures

    ORAL

    Presenters

    • Thomas Mayer

      Fraunhofer EMFT

    Authors

    • Thomas Mayer

      Fraunhofer EMFT

    • Hannes Bender

      Fraunhofer EMFT

    • Simon Lang

      Fraunhofer EMFT

    • Luis Schwarzenbach

      Fraunhofer EMFT

    • Waltraud Hell

      Fraunhofer EMFT

    • Johannes Weber

      Fraunhofer EMFT

    • Carla Morán Guizán

      Fraunhofer EMFT

    • Chawki Dhieb

      Fraunhofer EMFT

    • Daniela Zahn

      Fraunhofer EMFT

    • Zhen Luo

      Technical University of Munich (TUM), Fraunhofer EMFT, TU Munich

    • Mihail Andronic

      Fraunhofer EMFT

    • Armin Klumpp

      Fraunhofer EMFT

    • Andreas Drost

      Fraunhofer EMFT

    • Karl Neumeier

      Fraunhofer EMFT

    • Wilfried Lerch

      Fraunhofer EMFT

    • Lars Nebrich

      Fraunhofer EMFT

    • Ignaz Eisele

      Fraunhofer EMFT

    • Rui N Pereira

      Fraunhofer EMFT

    • Christoph Kutter

      Fraunhofer EMFT

    View abstract →

  • Scalable path towards 3D integration of superconducting qubits using advanced 300mm foundry manufacturing capabilities

    ORAL

    Presenters

    • A. M. Vadiraj

      IMEC, imec

    Authors

    • A. M. Vadiraj

      IMEC, imec

    • Rohith Acharya

      Katholieke University Leuven, IMEC, imec

    • Anton Potočnik

      imec

    • Anish Dangol

      imec

    • Jaber Derakhshandeh

      imec

    • Shana Massar

      IMEC, imec

    • Maël Demarets

      KU Leuven, IMEC, KU Leuven, imec

    • Jacques Van Damme

      IMEC, KU Leuven, imec

    • Daniel Perez Lozano

      imec

    • Tsvetan Ivanov

      IMEC, imec

    • Yann Canvel

      IMEC, imec

    • Adham Elshaer

      imec

    • Punith Mudigere Krishne Gowda

      imec

    • Ehsan Shafahian

      imec

    • Bensu Tunca Altintas

      imec

    • Massimo Mongillo

      IMEC, imec

    • Danny Wan

      IMEC, imec

    • Kristiaan DeGreve

      IMEC, IMEC, KU Leuven, imec, KU Leuven, imec

    View abstract →

  • Characterizing superconducting airbridges fabricated using a grayscale electron-beam lithography process

    ORAL

    Presenters

    • Prakiran Baidya

      Friedrich-Alexander University Erlangen-Nürnberg, Friedrich-Alexander-Universität Erlangen-Nürnberg

    Authors

    • Prakiran Baidya

      Friedrich-Alexander University Erlangen-Nürnberg, Friedrich-Alexander-Universität Erlangen-Nürnberg

    • Momčilo Milosavljevic

      Friedrich-Alexander University Erlangen-Nürnberg, Friedrich-Alexander-Universität Erlangen-Nürnberg

    • Murali Krishna KURMAPU

      Friedrich-Alexander University Erlangen-Nuremberg

    • Victor Kemme

      Friedrich-Alexander University Erlangen-Nürnberg, Friedrich-Alexander-Universität Erlangen-Nürnberg

    • Thomas Fösel

      Friedrich-Alexander University Erlangen-Nürnberg, Friedrich-Alexander University Erlangen-Nuremberg, Friedrich-Alexander-Universität Erlangen-Nürnberg

    • Christopher Eichler

      Friedrich-Alexander University Erlangen-Nuremberg

    View abstract →

  • Fabrication of Low-Loss Niobium Air Bridges for Superconducting Qubit Applications

    ORAL

    Presenters

    • Niklas Bruckmoser

      Walther-Meissner-Institute, TU Munich, TUM

    Authors

    • Niklas Bruckmoser

      Walther-Meissner-Institute, TU Munich, TUM

    • Leon Koch

      TU Munich

    • Ivan Tsitsilin

      TU Munich

    • David Bunch

      Walther-Meißner-Institute, TU Munich

    • Lea Richard

      Walther-Meißner-Institute, TU Munich

    • Kedar E Honasoge

      Walther-Meißner-Institut, Walther-Meißner-Institut, Technical University Munich, Walther-Meißner-Institut; Technical University of Munich, Walther Meissner Inst, TU Munich

    • Thomas Luschmann

      Walther Meissner Inst, TU Munich

    • Maria-Teresa Handschuh

      Walther-Meißner-Institut, Walther-Meißner-Institut, Technical University Munich, Walther-Meißner-Institut; Technical University of Munich, TU Munich

    • Lasse Soedergren

      Walther-Meißner-Institute, TU Munich, TUM

    • Vera Bader

      Walther-Meißner-Institut, TU Munich

    • Christian Schneider

      Walther-Meissner-Institute, TU Munich & Walther-Meißner-Institut, TU Munich, Walther-Meißner-Institut, Bayerische Akademie der Wissenschaften, 85748 Garching, Walther-Meißner-Institute, TUM

    • Max Werninghaus

      TU Munich, TU Munich, Walther-Meißner-Institute

    • Stefan Filipp

      TU Munich, TU Munich, Walther-Meißner-Institute

    View abstract →

  • Influence of scaling up technologies on transmon coherence

    ORAL

    Presenters

    • Leon Koch

      TU Munich

    Authors

    • Leon Koch

      TU Munich

    • Niklas Bruckmoser

      Walther-Meissner-Institute, TU Munich, TUM

    • Lea Richard

      Walther-Meißner-Institute, TU Munich

    • David Bunch

      Walther-Meißner-Institute, TU Munich

    • Ivan Tsitsilin

      TU Munich

    • Kedar E Honasoge

      Walther-Meißner-Institut, Walther-Meißner-Institut, Technical University Munich, Walther-Meißner-Institut; Technical University of Munich, Walther Meissner Inst, TU Munich

    • Maria Handschuh

      Walther-Meißner-Institute

    • Lasse Soedergren

      Walther-Meißner-Institute, TU Munich, TUM

    • Vera Bader

      Walther-Meißner-Institut, TU Munich

    • Christian Schneider

      Walther-Meissner-Institute, TU Munich & Walther-Meißner-Institut, TU Munich, Walther-Meißner-Institut, Bayerische Akademie der Wissenschaften, 85748 Garching, Walther-Meißner-Institute, TUM

    • Max Werninghaus

      TU Munich, TU Munich, Walther-Meißner-Institute

    • Stefan Filipp

      TU Munich, TU Munich, Walther-Meißner-Institute

    View abstract →

  • Surface participation and dielectric loss in flipchip superconducting qubits

    ORAL

    Presenters

    • YEN-AN SHIH

      Delft University of Technology

    Authors

    • YEN-AN SHIH

      Delft University of Technology

    • siddharth singh

      Delft University of Technology

    • Rebecca Gharibaan

      Delft University of Technology

    • Nataliia Zhurbina

      Delft University of Technology

    • Lukas J Splitthoff

      Chalmers University of Technology, Delft University of Technology

    • Taryn Victoria Stefanski

      University of Bristol

    • Christian Kraglund Andersen

      Delft University of Technology

    View abstract →

  • Efficient Routing and Interconnects for Superconducting Qubits

    ORAL · Invited

    Publication: R. N. Das et al., "Reworkable Superconducting Qubit Package for Quantum Computing," 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, CO, USA, 2024, pp. 427-432.<br>Yost, D.R.W., Schwartz, M.E., Mallek, J. et al. Solid-state qubits integrated with superconducting through-silicon vias. npj Quantum Inf 6, 59 (2020).<br>D. Rosenberg et al., "Solid-State Qubits: 3D Integration and Packaging," in IEEE Microwave Magazine, vol. 21, no. 8, pp. 72-85, Aug. 2020.

    Presenters

    • Mollie E Schwartz

      MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology

    Authors

    • Mollie E Schwartz

      MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology

    View abstract →

  • Liquid metal printing for superconducting circuits

    ORAL

    Presenters

    • Thomas Reisinger

      Karlsruhe Institute of Technology

    Authors

    • Thomas Reisinger

      Karlsruhe Institute of Technology

    • Navid Hussain

      Karlsruhe Institute of Technology

    • Alexander Kreiner

      Karlsruhe Institute of Technology

    • Haoran Duan

      Karlsruhe Institute of Technology

    • Ritika Dhundhwal

      Karlsruhe Institute of Technology

    • Gabriel G Marques

      Karlsruhe Institute of Technology

    • Michael Hirtz

      Karlsruhe Institute of Technology

    • Ioan M. Pop

      Karlsruhe Institute of Technology

    • Jasmin Aghassi

      Karlsruhe Institute of Technology

    View abstract →

  • Characterizing the impacts of sequential Josephson Junction fabrication on superconducting circuit performance

    ORAL

    Presenters

    • Duncan Miller

      MIT Lincoln Laboratory

    Authors

    • Duncan Miller

      MIT Lincoln Laboratory

    • Bethany M Niedzielski

      MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology

    • Mallika T Randeria

      MIT Lincoln Laboratory

    • Hannah M Stickler

      MIT Lincoln Laboratory

    • David K Kim

      MIT Lincoln Lab, Lincoln Laboratory, Massachusetts Institute of Technology

    • Thomas M Hazard

      MIT Lincoln Laboratory

    • Michael Gingras

      MIT Lincoln Laboratory

    • Jeffrey M Knecht

      MIT Lincoln Laboratory

    • Kyle Serniak

      MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology

    • Cyrus F Hirjibehedin

      MIT Lincoln Laboratory

    • Jonilyn L Yoder

      MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology

    • Mollie E Schwartz

      MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology

    View abstract →

  • Physical-Size Biasing Corrections for Improved Josephson Junction Targeting

    ORAL

    Presenters

    • Hannah M Stickler

      MIT Lincoln Laboratory

    Authors

    • Hannah M Stickler

      MIT Lincoln Laboratory

    • Bethany M Niedzielski

      MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology

    • Michael Gingras

      MIT Lincoln Laboratory

    • Jeffrey M Knecht

      MIT Lincoln Laboratory

    • Kevin Grossklaus

      MIT Lincoln Laboratories, MIT Lincoln Laboratory

    • Kate Azar

      Massachusetts Institute of Technology, MIT, MIT Lincoln Laboratory

    • Renée DePencier Piñero

      MIT Lincoln Laboratory, Lincoln Laboratory, MIT

    • Greg Calusine

      MIT Lincoln Laboratory

    • Ali Sabbah

      MIT Lincoln Laboratory

    • Felipe Contipelli

      MIT Lincoln Laboratory

    • Duncan Miller

      MIT Lincoln Laboratory

    • Arthur Kurlej

      MIT Lincoln Laboratory

    • Jonilyn L Yoder

      MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology

    • Mollie E Schwartz

      MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology

    • William D Oliver

      Massachusetts Institute of Technology, Massachusetts Institute of Technology (MIT)

    • Kyle Serniak

      MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology

    View abstract →

  • A Compact, Extensible, and Flexible Cable Solution for Superconducting Qubit

    ORAL

    Presenters

    • John Cummings

      MIT Lincoln Laboratory

    Authors

    • John Cummings

      MIT Lincoln Laboratory

    • Xhovalin Miloshi

      MIT Lincoln Laboratory

    • Gabriel Cutter

      Massachusetts Institute of Technology

    • Steven J Weber

      MIT Lincoln Laboratory

    • Felipe Contipelli

      MIT Lincoln Laboratory

    • Renée D DePencier Piñero

      MIT Lincoln Laboratory

    • Michael Gingras

      MIT Lincoln Laboratory

    • Jennifer Hritz

      MIT Lincoln Laboratory

    • Madeline Morocco

      MIT Lincoln Laboratory

    • Bethany M Niedzielski

      MIT Lincoln Laboratory

    • Kyle Serniak

      MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology

    • Hannah M Stickler

      MIT Lincoln Laboratory

    • William D Oliver

      Massachusetts Institute of Technology, Massachusetts Institute of Technology (MIT)

    • Jonilyn L Yoder

      MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology

    • Cyrus F Hirjibehedin

      MIT Lincoln Laboratory

    • Mollie E Schwartz

      MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology

    View abstract →