Assessing bond interfaces for shock temperature measurements

Radiometric measurements of opaque materials cannot determine the bulk conditions within a sample. These measurements require analyzing emission from the interface of the opaque material with a transparent material. The transparent “window” maintains the interface conditions at non-zero stress. The sample and window may be in direct contact or bonded using a transparent adhesive. We experimentally tested the transparency and emission of direct contact interfaces and several commonly used adhesives under shock loading up to 136 GPa. We compare the thermal histories of bonded and direct contact interfaces and establish an extended domain for radiometric measurement and analysis of shock temperature.