Microelectronics Manufacturing: A Vision Towards the Next Decade

The ongoing transformation of microelectronics manufacturing into the Angstrom era continues to challenge Moore’s Law technically, while also facing significant workforce and manufacturing capability shortages. The next decade will demand excellence in executing new innovations, alongside the integration of a qualified workforce and the incorporation of AI as a tool to bridge gaps in product and process development.

In this talk, we will explore the progress of microelectronics from two decades ago and project into the next decade. We will address groundbreaking ideas in transistor design, examine new and unconventional integration schemes through advanced packaging and hybrid wafer bonding, and discuss the functionalization of digital twins in microelectronics manufacturing.

Establishing fundamental, mechanism-based correlations between process conditions and observed process performance can lead to the creation of industry-wide technical standards through digital twins (i.e., real-time digital replicas of unit processes). This will enable effective process selection and integration, as well as help reduce the cost of ownership by enhancing productivity. We will also explore the opportunities presented by digital twins for advanced packaging, using the Chemical Mechanical Planarization/Polishing (CMP) process as a use case.