Additive Packaging Solutions: RF transparent coatings for heterogeneous IC integration

With the increased demands for hybrid/heterogeneous integrated circuits, there exists a similar need for hybrid and "on-demand" packaging. In order to expand the capabilities of additive manufacturing techniques, we present a transparent Fluoroplastic (THV 221 GZ) based material system which can act as a printable, low RF loss, adhesion promoter and encapsulant. We describe methods to overcome coarse surfaces, flexible substrates, and precise area coverage of thin coatings. Our materials and methods can be used to functionalize a variety of substrates including UHMWPE composite, RF laminate (I-Tera MT40), and Kapton. Additionally, we present multiple formulations for a variety of deposition methods including spraying, extruding, and spreading. As a case-study we demonstrate the integration of pre-packaged ICs, printable material systems, and our THV based coating for increased stability and resilience of RF circuits and sensors fabricated with additive manufacturing (AM) techniques. As the demand for non-traditional packaging and integration increases, this work can offer novel ideas for how AM RF circuits and ICs can be integrated into functional/hybrid devices.