Heat transport across thermal contraction activated linear polymer clamps

As quantum processors and cryogenic apparatus scale up in complexity, wiring experiments in-situ has become untenable. Top and side-loading wiring inserts allow for faster wiring than installing individual wires but are still time consuming. Moreover, the confined space of cryogenic systems often results in improperly torqued bolts, leading to poor thermalization, damaged components, and inconsistent performance of sensitive equipment. A novel polymer clamp is developed to provide a higher density, firmer, and more consistent clamping force for thermalization while reducing footprint. The thermal transport at 50K and 4K is characterized and compared for clamped and bolted interfaces. Thermal cycling, repeatability, and durability of clamped connections after >100 thermal cycles were also investigated.