Ambient-Stable Two-Dimensional CrI<sub>3</sub> via Organic-Inorganic Encapsulation
ORAL
Abstract
2D transition metal halides have recently attracted significant attention due to their thickness dependent magnetism and electrical control of magnetic order. However, this class of materials is extremely reactive chemically, leading to rapid irreversible degradation upon ambient exposure. Here we demonstrate long-term encapsulation of the prototypical 2D transition metal halide CrI3 by using atomic layer deposition (ALD) of alumina that is seeded with an organic buffer layer of perylenetetracarboxylic dianhydride (PTCDA). We show that this protocol allows for long-term encapsulation of CrI3 and preserves the structure and magnetic order down to monolayer thickness. In the absence of the PTCDA buffer layer, the ALD precursors damage the CrI3 top layer as revealed by X-ray photoelectron spectroscopy and thickness dependent magneto-optical Kerr-effect measurements. With this hybrid organic-inorganic encapsulation protocol, we demonstrate field-effect transistors, photodetectors, and optothermal measurements of CrI3 thermal conductivity in ambient conditions. Ongoing efforts to extend this methodology to charge transport measurements of additional 2D transition metal halides will also be discussed.
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Publication: ACS Nano 2021, 15, 6, 10659–10667
Presenters
Dmitry Lebedev
Northwestern University
Authors
Dmitry Lebedev
Northwestern University
Tyler J Gish
Northwestern University
Teodor Stanev
Northwestern University
Shizhou Jiang
Northwestern University
Leonidas Georgopoulos
Northwestern University
Thomas W Song
Northwestern University
Gilhwan Lim
Northwestern University
Ethan S Garvey
Northwestern University
Lukáš Valdman
University of Chemistry and Technology Prague
Oluwaseyi Balogun
Northwestern University
Zdenek Sofer
University of Chemistry and Technology Prague
Vinod K Sangwan
Northwestern University, Materials Science and Engineering, Northwestern University, Evanston, IL 60208
Nathaniel P Stern
Northwestern University
Mark C Hersam
Northwestern University, Materials Science and Engineering, Northwestern University, Evanston, IL 60208