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Mechanism of Thermally Activated Memristive Switching in Percolating Networks of 2D Semiconductor Nanosheets

ORAL

Abstract

Brain-inspired computing hardware is emerging as a promising paradigm to dramatically reduce power consumption compared to conventional digital computing limited by the von Neumann bottleneck. Nanoscale devices such as non-volatile memristors and volatile dynamical switches are being explored as underlying building blocks for neuromorphic circuits. Memristors based on two-dimensional (2D) materials enable tunable electrostatic coupling, novel bio-realistic functions, large-area, flexible, and printed neuromorphic circuits [1-4]. However, the memristive switching mechanisms in 2D nanosheet composites are poorly understood. Here, we present thermally activated memristive switching mechanisms in percolating networks of diverse solution-processed 2D semiconductors including MoS2, ReS2, WS2, and InSe [5]. The mechanism is elucidated by direct observation of channels using spatially resolved optical and chemical analyses (revealing oxygen-deficient filaments) and in situ thermal analysis (revealing local heating up to 115 °C). These devices show high switching ratios (up to 103) at low global electric fields (≈4 kV cm−1) that is explained by a thermally assisted electrical discharge that preferentially occurs at the sharp edges of 2D nanosheets. These results establish percolating networks of 2D nanosheets as an interesting materials system for high-order non-dynamical systems for neuromorphic circuits.  

References:

[1] V. K. Sangwan and M. C. Hersam, Nature Nanotechnology, 15, 517 (2020).

[2] V. K. Sangwan, H.-S. Lee, et al., Nature, 554, 500-504 (2018).

[3]  H.-S. Lee, V. K. Sangwan, et al., Advanced Functional Materials 30, 2003683 (2020).

[4] M. E. Beck and M. C. Hersam, ACS Nano, 14, 6498 (2020).

[5] V. K. Sangwan, S. V. Rangnekar, J. Kang, et al.,, Advanced Functional Materials DOI:10.1002/adfm.202107385 (2021).

Publication: V. K. Sangwan, S. V. Rangnekar, J. Kang, J. Shen, H.-S. Lee, D. Lam, J. Shen, X. Liu, A. C. M. de Moraes, L. Kuo, J. Gu, H. Wang, and M. C. Hersam, Advanced Functional Materials DOI:10.1002/adfm.202107385 (2021)

Presenters

  • Vinod K Sangwan

    Northwestern University, Materials Science and Engineering, Northwestern University, Evanston, IL 60208

Authors

  • Vinod K Sangwan

    Northwestern University, Materials Science and Engineering, Northwestern University, Evanston, IL 60208

  • Sonal V Rangnekar

    Materials Science and Engineering, Northwestern University, Evanston, IL 60208

  • Joohoon Kang

    Materials Science and Engineering, Northwestern University, Evanston, IL 60208

  • Jie Gu

    Electrical and Computer Engineering, Northwestern University, Evanston, IL 60208

  • Haihua Wang

    Materials Science and Engineering, Northwestern University, Evanston, IL 60208

  • Mark C Hersam

    Northwestern University, Materials Science and Engineering, Northwestern University, Evanston, IL 60208