High volume manufacturing of silicon spin qubits

High volume manufacturing in the semiconductor industry has enabled the integration of billions of transistors on a single chip and could be used to address the significant engineering challenges for the scale up of quantum computers. Here, we discuss how we are using the 300mm infrastructure at Intel to fabricate highly coherent (T2_CPMG ~ 3ms) silicon spin qubits that are similar in size to transistors and that can be integrated with advanced CMOS technologies. In addition, we will show how we have developed new measurement infrastructure, such as the 300mm cryoprober, to provide much faster and statistically relevant feedback to the fab to accelerate device improvements.