Ultrahigh-<i>χ</i> Block Copolymer Materials with Versatile Etch Selectivity for Sub-10 nm Pattern Transfer
POSTER
Abstract
Studies of block copolymer (BCP) materials and their phase separation in bulk and thin-film have exploded over the last decades due to the wide range of accessible morphologies and feature sizes. The basic BCP self-assembly principles have enabled the community to control the domain size and target the smallest sizes possible using BCPs with high interaction parameter. Accessing sub-5 nm feature size is not a challenge anymore. Transferring the BCP features to a substrate over a large area with high fidelity presents additional challenges, especially at the 10 nm length scale. In this work, the highly polar poly(3-hydroxystyrene) (P3HS) is incorporated with poly(dimethylsiloxane) (PDMS). We explore both P3HS/PDMS-based diblocks and triblocks. The BCPs show various well-ordered structures with the smallest lameallar domain of 7.4 nm. Mean-field theory analysis of the temperature-dependent correlation-hole scattering gives χ(T) = 33.491/T + 0.3126. Thin-film self-assembly is studied and the domains are aligned vertically by solvent annealing. These new BCPs not only exhibit high interaction parameter, but also present high etch contrast and versatility to facilitate pattern transfer.
Presenters
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Jian Sun
University of Wisconsin - Madison
Authors
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Jian Sun
University of Wisconsin - Madison
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Koei Azuma
Tokyo Institute of Technology
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Youngwoo Choo
Yale University
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Changyeon Lee
University of Pennsylvania, Department of Chemical & Biomolecular Engineering, KAIST
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Jonathan Dwyer
University of Wisconsin - Madison
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Yekaterina Rokhlenko
Yale University
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Teruaki Hayakawa
Tokyo Institute of Technology
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Chinedum Osuji
University of Pennsylvania, Chemical and Biomolecular Engineering, University of Pennsylvania
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Padma Gopalan
University of Wisconsin - Madison