Expanding Bandwidth through Coupled Silicon and Hyperbolic Waveguides in the Near- and Mid-Infrared
ORAL
Abstract
Silicon photonics has enabled large-scale manipulation and processing of optical signals on chip-based architectures. Yet, there is significant desire to expand the operational bandwidth of such integrated systems. While one solution is to spatially multiplex channels operating at the same frequency, an alternative is to expand existing architectures by integrating waveguides that operate at different frequencies within the same form factor. To realize this, the modal wavelength in each waveguide should be closely matched for effective confinement. Here, we integrate hyperbolic phonon polariton (HPhP) waveguides within a slab of hexagonal boron nitride (hBN) onto a silicon photonics platform, enabling dual-band operation at both telecom (1.55 µm) and mid-infrared (6.1-7.4 µm) frequencies simultaneously. Dual band operation is demonstrated as the deeply sub-diffractional, volume-confined nature of HPhPs allows the polariton wavelength to be designed to directly match that of the silicon waveguide, yet operate at drastically different operational frequencies. This eliminates potential challenges from modal cross-talk, with the index contrast between the silicon waveguide and surrounding air sufficient to induce waveguiding of the HPhPs in the hBN without patterning.
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Presenters
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Joshua Caldwell
Vanderbilt Univ, Department of Mechanical Engineering and Electrical Engineering, Vanderbilt University
Authors
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Mingze He
Vanderbilt Univ
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Sami Halimi
Vanderbilt Univ
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Thomas G Folland
University of Iowa
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Sai Sunku
Columbia University, Columbia Univ, Physics, Columbia University
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Song Liu
Kansas State University
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James Edgar
Chemical Engineering, Kansas State University, Kansas State University, Tim Taylor Department of Chemical Engineering, Kansas State University
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Dmitri Basov
Columbia University, Department of Physics, Columbia University, Physics, Columbia University, Columbia Univ
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Sharon Weiss
Vanderbilt Univ
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Joshua Caldwell
Vanderbilt Univ, Department of Mechanical Engineering and Electrical Engineering, Vanderbilt University