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A universal method for depositing patterned materials in-situ

POSTER

Abstract

Current techniques of patterned material deposition require separate steps for patterning
and material deposition. The complexity and harsh working conditions post serious limita-
tions for fabrication. Here, we introduce a single-step and easy-to-adapt method that can
deposit materials in-situ. Its methodology is based on the semiconductor nanoparticle as-
sisted photon-induced chemical reduction and optical trapping. This universal mechanism
can be used for depositing a large selection of materials including metals, insulators and
magnets, with quality on par with current technologies. Patterning with several materi-
als together with optical-diffraction-limited resolution and accuracy can be achieved from
macroscopic to microscopic scale. Furthermore, the setup is naturally compatible with op-
tical microscopy based measurements, thus sample characterisation and material deposition
can be realised in-situ. Various devices fabricated with this method in 2D or 3D show it is
ready for deployment in practical applications. This method will provide a distinct tool in
material technology.

Presenters

  • Yifan CHEN

    Chinese University of Hong Kong

Authors

  • Yifan CHEN

    Chinese University of Hong Kong

  • Siu Fai HUNG

    Chinese University of Hong Kong

  • Sen YANG

    Chinese University of Hong Kong

  • Kangwei Xia

    Chinese University of Hong Kong