All Optical 300mm process line for spin qubit devices

Intel has established a 300mm process line for the fabrication of spin qubit devices using all optical lithography. The customized QC test-chip provides a diversity of test structures: Transistors, Hall Bars, Quantum Dots, and qubit devices at varying dimensions and 1-D array size. Each wafer has ~80 die with thousands of devices, which allows statistical process control of yield and performance. We have implemented testing at industrial scale, with devices/processes that can be characterized in-house at room temperature and low temperature (1.6K). In this talk, we will provide an overview of integration scheme and yield. We will also discuss key device metrics at both room and low temperatures, in addition to the standard QD/qubit metrics which are normally used. We will present the progress from Transistor to QD devices, and for the first time, we will demonstrate full 300mm spin qubit devices with performance comparable to leading academic devices.