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Remote Epitaxy of SrTiO<sub>3</sub> using Hybrid Molecular Beam Epitaxy

ORAL

Abstract

Line defects such as dislocations in heteroepitaxial films can have many undesirable consequences to the films’ electronic properties including carrier compensation and lower carrier mobilities. In this talk, we will discuss the remote epitaxy approach for the growth of SrTiO3 (STO) films on different substrates using hybrid molecular beam epitaxy (MBE). The use of titanium isopropoxide (TTIP) as a source of both titanium and oxygen allowed the growth of epitaxial STO without oxidation of the graphene layer. STO could be exfoliated from the substrate as a freestanding membrane and transferred on to a flexible polymer substrate. We will discuss how the graphene interlayer effects the structural quality and strain relaxation, and its implications for defect management in heteroepitaxial thin films.

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Presenters

  • Hyojin Yoon

    Department of Chemical Engineering and Materials Science, University of Minnesota

Authors

  • Hyojin Yoon

    Department of Chemical Engineering and Materials Science, University of Minnesota

  • Tristan Truttmann

    Department of Chemical Engineering and Materials Science, University of Minnesota, University of Minnesota

  • Rashmi Choudhary

    Department of Chemical Engineering and Materials Science, University of Minnesota, University of Minnesota

  • Qun Su

    Department of Electrical and Computer Engineering, University of Minnesota

  • Ruixue Li

    Department of Electrical and Computer Engineering, University of Minnesota

  • Vivek Saraswat

    Department of Materials Science and Engineering, University of Wisconsin

  • Sebastian Manzo

    Department of Materials Science and Engineering, University of Wisconsin

  • Steven J Koester

    Department of Electrical and Computer Engineering, University of Minnesota

  • Michael Arnold

    University of Wisconsin - Madison, Department of Materials Science and Engineering, University of Wisconsin

  • Jason Kawasaki

    Department of Materials Science and Engineering, University of Wisconsin

  • Bharat Jalan

    University of Minnesota, Department of Chemical Engineering and Materials Science, University of Minnesota, Department of Electrical and Computer Engineering, University of Minnesota