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Extending Superconducting Qubits Out of Plane (Part 2): Through-Silicon Vias

ORAL

Abstract

Addressing complex arrays of high coherence qubits is a necessary capability for the construction of a quantum processor. To enable high connectivity of superconducting qubits we are utilizing heterogeneous 3D integration of a qubit tier, an interposer with high-aspect-ratio superconducting through-silicon vias (TSVs), and a superconducting multi-chip module. In part 2 of this talk we will focus on the fabrication of TSVs within the interposer tier and their implementation within multi-tier stacks.

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Presenters

  • Justin Mallek

    MIT Lincoln Laboratory

Authors

  • Justin Mallek

    MIT Lincoln Laboratory

  • Jonilyn Yoder

    MIT Lincoln Laboratory, MIT-Lincoln Lab, Lincoln Laboratory, Massachusetts Institute of Technology (MIT), MIT Lincoln Lab

  • Donna-Ruth Yost

    MIT Lincoln Laboratory

  • Rabindra Das

    MIT Lincoln Laboratory, MIT Lincoln Laboratories

  • Alexandra Day

    MIT Lincoln Laboratory, Massachusetts Institute of Technology MIT

  • Danna Rosenberg

    MIT Lincoln Laboratory, MIT Lincoln Lab, MIT Lincoln Laboratories, Massachusetts Institute of Technology

  • Greg Calusine

    MIT Lincoln Lab, MIT Lincoln Laboratory

  • Matthew Cook

    MIT Lincoln Laboratory

  • Evan Golden

    MIT Lincoln Laboratory, Massachusetts Institute of Technology MIT

  • David K Kim

    MIT Lincoln Laboratory, MIT Lincoln Lab, MIT-Lincoln Lab, MIT Lincoln Laboratories, Lincoln Laboratory, Massachusetts Institute of Technology (MIT), Massachusetts Institute of Technology (MIT) Lincoln Laboratory

  • Alexander Melville

    MIT Lincoln Laboratory, MIT Lincoln Lab, MIT Lincoln Laboratories, Massachusetts Institute of Technology (MIT) Lincoln Laboratory

  • Bethany Niedzielski

    MIT Lincoln Laboratory

  • Mollie Schwartz

    MIT Lincoln Laboratory, MIT Lincoln Lab

  • Corey Stull

    MIT Lincoln Laboratory

  • Sergey Tolpygo

    MIT Lincoln Laboratory

  • Wayne Woods

    MIT Lincoln Lab, MIT Lincoln Laboratory

  • William Oliver

    Research Laboratory of Electronics, Department of Electrical Engineering and Computer Science, Department of Physics, MIT Lincoln Laboratory, Massachusetts Institute of Techn, MIT Lincoln Lab, MIT Lincoln Laboratory, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Department of Physics, Department of Electrical Engineering and Computer Science, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology MIT, Massachusetts Institute of Technology MIT, Department of Electrical Engineering and Computer Science, Department of Physics, Massachusetts Institute of Technology; MIT Lincoln Laboratory, Department of Electrical Engineering and Computer Science, Department of Physics, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology, Research Laboratory of Electronics, Department of Electrical Engineering & Computer Science, Department of Physics, Massachusetts Institute of Technology and MIT Lincoln Labo, Physics, MIT, MIT-Lincoln Lab, MIT Lincoln Laboratories, Research Laboratory of Electronics, Department of Physics, Department of Electrical Engineering and Computer Science, Lincoln Laboratory, Massachusetts Institute of Technolog