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Extending Superconducting Qubits Out of Plane (Part 1): Qubits with Air Bridge Crossovers in Multi-Tier Stacks

ORAL

Abstract

Out-of-plane connectivity within superconducting quantum circuits enables increased complexity and wiring density. We are developing heterogeneous 3D integration of a qubit tier combined with an interposer with high-aspect-ratio superconducting through-silicon vias and a superconducting multi-chip module. In part 1 of this talk, we will focus on circuit complexity within the superconducting qubit tier, including implementation of air bridge crossovers (1) to increase mutual inductance by directly embedding them within qubit and coupler loops, (2) to improve connectivity of the ground plane, and (3) as a method for routing wires and circuit elements past each other.

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Presenters

  • Jonilyn Yoder

    MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Institute of Technology (MIT) Lincoln Laboratory

Authors

  • Jonilyn Yoder

    MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Institute of Technology (MIT) Lincoln Laboratory

  • Justin Mallek

    MIT Lincoln Laboratory

  • David K Kim

    MIT Lincoln Laboratory, MIT Lincoln Lab, MIT-Lincoln Lab, MIT Lincoln Laboratories, Lincoln Laboratory, Massachusetts Institute of Technology (MIT), Massachusetts Institute of Technology (MIT) Lincoln Laboratory

  • Donna-Ruth Yost

    MIT Lincoln Laboratory

  • Greg Calusine

    MIT Lincoln Lab, MIT Lincoln Laboratory

  • Rabindra Das

    MIT Lincoln Laboratory, MIT Lincoln Laboratories

  • Alexandra Day

    MIT Lincoln Laboratory, Massachusetts Institute of Technology MIT

  • Alexander Melville

    MIT Lincoln Laboratory, MIT Lincoln Lab, MIT Lincoln Laboratories, Massachusetts Institute of Technology (MIT) Lincoln Laboratory

  • Bethany M Niedzielski

    MIT Lincoln Laboratory

  • Danna Rosenberg

    MIT Lincoln Laboratory, MIT Lincoln Lab, MIT Lincoln Laboratories, Massachusetts Institute of Technology

  • Gabriel Orr Samach

    MIT Research Laboratory of Electronics, MIT Department of Electrical Engineering and Computer Science, MIT Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Institute of Technology MIT, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology, MIT Lincoln Laboratory

  • Mollie Schwartz

    MIT Lincoln Laboratory, MIT Lincoln Lab

  • Steven Weber

    MIT Lincoln Laboratory

  • William Oliver

    Research Laboratory of Electronics, Department of Electrical Engineering and Computer Science, Department of Physics, MIT Lincoln Laboratory, Massachusetts Institute of Techn, MIT Lincoln Lab, MIT Lincoln Laboratory, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Department of Physics, Department of Electrical Engineering and Computer Science, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology MIT, Massachusetts Institute of Technology MIT, Department of Electrical Engineering and Computer Science, Department of Physics, Massachusetts Institute of Technology; MIT Lincoln Laboratory, Department of Electrical Engineering and Computer Science, Department of Physics, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology, Research Laboratory of Electronics, Department of Electrical Engineering & Computer Science, Department of Physics, Massachusetts Institute of Technology and MIT Lincoln Labo, Physics, MIT, MIT-Lincoln Lab, MIT Lincoln Laboratories, Research Laboratory of Electronics, Department of Physics, Department of Electrical Engineering and Computer Science, Lincoln Laboratory, Massachusetts Institute of Technolog