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Growth and electrical transport properties of (110) YBa<sub>2</sub>Cu<sub>3</sub>O<sub>7</sub> / (110) PrBa<sub>2</sub>(Cu<sub>0.8</sub>Ga<sub>0.2</sub>)<sub>3</sub>O<sub>7 </sub>heterostructure

ORAL

Abstract

We performed pulsed laser-based thin film deposition and study of electrical transport properties on (110)-oriented YBa2Cu3O7 (YBCO)/ (110)-oriented PrBa2(Cu0.8Ga0.2)3O7 heterostructure for the nanofabrication of Superconductor (S) / Insulator (I) / Superconductor (S) tunneling Josephson junction device which may have many advantages over the conventional low-temperature superconductor-based Josephson junction devices including low cost, cryogenic system simplicity, and high IcRn product (with Ic being the junction critical current and Rn the normal resistance). X-ray diffraction pattern (XRD) analysis, atomic force microscopy (AFM), and electrical transport studies were carried out to check the orientation, thickness, roughness, surface morphology, critical temperature (TC), and electrical resistivities of the heterostructures. Here, we report the optimization process for the layer by layer growth, multi-layer epitaxy, thickness control of the superconductor and insulator layers, and the electrical transport properties of the (110) YBa2Cu3O7 / (110) PrBa2(Cu0.8Ga0.2)3O7 heterostructure.

Presenters

  • Hom Kandel

    Physics, University of Wisconsin-Parkside

Authors

  • Hom Kandel

    Physics, University of Wisconsin-Parkside

  • Nathan D Arndt

    Physics, University of Wisconsin-Parkside

  • Jungwoo Li

    Materials Science & Engineering, University of Wisconsin-Madison

  • Chang-Beom Eom

    Univ of Wisconsin-Madison, Materials Science and Engineering, University of Wisconsin-Madison, University of Wisconsin–Madison, Department of Materials Science and Engineering, University of Wisconsin-Madison, Materials Science & Engineering, University of Wisconsin-Madison, University of Wisconsin - Madison, Department of Materials Science and Engineering, University of Wisconsin - Madison, Department of Materials Science and Engineering, University of Wisconsin at Madison