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3D integrated device architecture for hybrid superconductor-semiconductor quantum dot devices

ORAL

Abstract

Low internal losses in superconducting resonators require optimized fabrication that was developed in the framework of superconducting qubits. Semiconductor spin-qubit experiments in hybrid super-semi cQED involve semiconducting substrates, gate-oxides, dopants or even micromagnets, which may not be compatible with conventional resonator fabrication leading to higher internal losses. Here we present a 3D integrated super-semi architecture with the superconducting resonator chip fabricated in an environment optimized for superconducting qubits and then flip-chip bonded onto a spin-qubit chip fabricated in its own dedicated facility. Compared to previous cQED experiments with semiconductor spins, we demonstrate reduced photon losses in the few-photon regime and with Al gate-electrodes connected to the resonator. Using a perforated ground plane, we achieve Q=74k at an in-plane magnetic field of 100 mT, which is required for spin-photon coupling.

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Presenters

  • Felix Julian Schupp

    Physics, Princeton University

Authors

  • Felix Julian Schupp

    Physics, Princeton University

  • Xanthe Croot

    Physics, Princeton University, Princeton University

  • Felix Borjans

    Physics, Princeton University, Princeton University

  • Xiao Mi

    Google LLC, Physics, Princeton University, Princeton University, Google

  • Danna Rosenberg

    MIT Lincoln Laboratory, MIT Lincoln Lab, MIT Lincoln Laboratories, Massachusetts Institute of Technology

  • Rabindra Das

    MIT Lincoln Laboratory, MIT Lincoln Laboratories

  • David K Kim

    MIT Lincoln Laboratory, MIT Lincoln Lab, MIT-Lincoln Lab, MIT Lincoln Laboratories, Lincoln Laboratory, Massachusetts Institute of Technology (MIT), Massachusetts Institute of Technology (MIT) Lincoln Laboratory

  • Alexander Melville

    MIT Lincoln Laboratory, MIT Lincoln Lab, MIT Lincoln Laboratories, Massachusetts Institute of Technology (MIT) Lincoln Laboratory

  • William Oliver

    Research Laboratory of Electronics, Department of Electrical Engineering and Computer Science, Department of Physics, MIT Lincoln Laboratory, Massachusetts Institute of Techn, MIT Lincoln Lab, MIT Lincoln Laboratory, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Department of Physics, Department of Electrical Engineering and Computer Science, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology MIT, Massachusetts Institute of Technology MIT, Department of Electrical Engineering and Computer Science, Department of Physics, Massachusetts Institute of Technology; MIT Lincoln Laboratory, Department of Electrical Engineering and Computer Science, Department of Physics, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology, Research Laboratory of Electronics, Department of Electrical Engineering & Computer Science, Department of Physics, Massachusetts Institute of Technology and MIT Lincoln Labo, Physics, MIT, MIT-Lincoln Lab, MIT Lincoln Laboratories, Research Laboratory of Electronics, Department of Physics, Department of Electrical Engineering and Computer Science, Lincoln Laboratory, Massachusetts Institute of Technolog

  • Jason Petta

    Physics, Princeton University, Princeton University, Department of Physics, Princeton University, Princeton, New Jersey 08544, USA