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Robust descriptor for high-throughput discovery of alloyed topological insulators based on artificial intelligence

ORAL

Abstract

Significant advances have been made in predicting new topological materials using high-throughput empirical descriptors or symmetry-based indicators. To date, these approaches have been applied to materials in existing databases, and are severely limited to systems with well-defined symmetries, leaving a much larger materials space unexplored. Using tetradymites as a prototypical class of examples, we uncover a novel two-dimensional descriptor by applying an artificial intelligence (AI) based approach for fast and reliable identification of the topological characters of a drastically expanded range of materials, without prior determination of their specific symmetries and detailed band structures. By leveraging this descriptor that contains only the atomic number and electronegativity of the constituent species, we have readily scanned over four million alloys in the tetradymite family. Strikingly, nearly two million new topological insulators are identified, revealing a much larger territory of the topological materials world. The present work also attests the increasingly important role of such AI-based approaches in modern materials discovery.

Presenters

  • Guohua Cao

    Wuhan University

Authors

  • Guohua Cao

    Wuhan University

  • Runhai Ouyang

    Fritz-Haber-Institut der Max-Planck-Gesellschaft

  • Luca Ghiringhelli

    Fritz-Haber Institute, Fritz-Haber-Institut der Max-Planck-Gesellschaft

  • Matthias Scheffler

    Fritz Haber Institute of Max Planck Society, Fritz Haber Institute of the Max Planck Society, Berlin, Fritz-Haber-Institut der Max-Planck-Gesellschaft

  • Huijun Liu

    Wuhan University

  • Christian Carbogno

    Fritz Haber Institute of the Max Planck Society, Berlin, Fritz-Haber-Institut der Max-Planck-Gesellschaft

  • Zhenyu Zhang

    University of Science and Technology of China, Hefei 230026, China, ICQD, University of Science and Technology of China, University of Science and Technology of China, Hefei, China