Design, Modeling, and Measurement of Through-Silicon Via (TSV) Structures for Superconducting Quantum Computing
ORAL
Abstract
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Presenters
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Wayne Woods
MIT Lincoln Lab, MIT Lincoln Laboratory
Authors
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Wayne Woods
MIT Lincoln Lab, MIT Lincoln Laboratory
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Danna Rosenberg
MIT Lincoln Laboratory, MIT Lincoln Lab, MIT Lincoln Laboratories, Massachusetts Institute of Technology
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Mollie Schwartz
MIT Lincoln Laboratory, MIT Lincoln Lab
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Donna Yost
MIT Lincoln Lab
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Jonilyn Yoder
MIT Lincoln Laboratory, MIT-Lincoln Lab, Lincoln Laboratory, Massachusetts Institute of Technology (MIT), MIT Lincoln Lab
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William Oliver
Research Laboratory of Electronics, Department of Electrical Engineering and Computer Science, Department of Physics, MIT Lincoln Laboratory, Massachusetts Institute of Techn, MIT Lincoln Lab, MIT Lincoln Laboratory, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Department of Physics, Department of Electrical Engineering and Computer Science, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology MIT, Massachusetts Institute of Technology MIT, Department of Electrical Engineering and Computer Science, Department of Physics, Massachusetts Institute of Technology; MIT Lincoln Laboratory, Department of Electrical Engineering and Computer Science, Department of Physics, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology, Research Laboratory of Electronics, Department of Electrical Engineering & Computer Science, Department of Physics, Massachusetts Institute of Technology and MIT Lincoln Labo, Physics, MIT, MIT-Lincoln Lab, MIT Lincoln Laboratories, Research Laboratory of Electronics, Department of Physics, Department of Electrical Engineering and Computer Science, Lincoln Laboratory, Massachusetts Institute of Technolog