Influence of the Metal-MoS$_{2}$ interface on MoS$_{2}$ Transistor Performance

ORAL

Abstract

We compare the electrical characteristics of MoS$_{2}$ field-effect transistors (FETS) with Ag source/drain contacts with transistors with Ti contacts, and we demonstrate that the metal-MoS$_{2}$ interface is crucial to the final device performance. The topography of 5nm Au/5nm Ag (contact layer) and 5nm Au/5nm Ti metal films deposited onto mono- and few-layer MoS$_{2}$ was characterized by using scanning electron microscopy and atomic force microscopy. The surface morphology of the Au/Ti films on MoS$_{2}$ shows a rough, dewetting pattern while Au/Ag forms smooth, dense films. These smoother and denser Au/Ag contacts lead to improved carrier transport efficiency. FETs with Ag contacts show more than 60 times higher on-state current and a steeper subthreshold slope. Raman spectroscopy of MoS$_{2}$ covered with Au/Ag or Au/Ti films revealed that the contact layer is Ag or Ti, respectively. In addition, there is a dramatic difference in the heat transfer between the MoS$_{2}$ and the two metals: while laser heating is observed in Au/Ti covered MoS$_{2}$, no heating effects are seen in Au/Ag covered MoS$_{2}$. It is reasonable to conclude that the smoother and denser Ag contact leads to higher carrier transport efficiency and contributes to the improved thermal properties.

Authors

  • Hui Yuan

    Dept of Electrical and Computer Eng, George Mason University, Fairfax, VA

  • Guangjun Cheng

    PML, NIST, Semiconductor and Dimensional Metrology Div, NIST, Gaithersburg, MD

  • Angela Hight Walker

    National Institute of Standards and Technology, National Institute of Standards and Technology (NIST), Semiconductor and Dimensional Metrology Div, NIST, Gaithersburg, MD, National Institute of Standards and Technology, Gaithersburg, MD 20899, NIST

  • Lin You

    Semiconductor and Dimensional Metrology Div, NIST, Gaithersburg, MD, Semiconductor and Dimensional Metrology Division, National Institute of Standards and Technology

  • Joseph J. Kopanski

    Semiconductor and Dimensional Metrology Div, NIST, Gaithersburg, MD

  • Qiliang Li

    Dept of Electrical and Computer Eng, George Mason University, Fairfax, VA

  • Curt A. Richter

    Semiconductor and Dimensional Metrology Div, NIST, Gaithersburg, MD