Spin relaxation in strained n-type silicon
ORAL
Abstract
The impurity-induced spin-relaxation mechanism in heavily doped n-type silicon has been recently reported in Phys. Rev. Lett. \textbf{113}, 167201. The leading contribution to the spin-relaxation rate occurs due to electron transitions between momentum-space valleys that reside on different crystallographic axes (the so-called f-process). This spin relaxation mechanism can be suppressed by applying uniaxial compressive strain that lifts the valley degeneracy. By calculating the next-order contribution to the spin-relaxation rate due to intravalley scattering and intervalley scattering between opposite valleys (the so-called g-process), we find a significant enhancement of the spin lifetime.
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Authors
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Oleg Chalaev
University of Rochester
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Yang Song
University of Rochester, Department of Electrical and Computer Engineering, University of Rochester, Rochester, New York, 14627
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Hanan Dery
University of Rochester