Evaluating Heat Dissipation in Si/SiGe Nanostructures using Raman Scattering
ORAL
Abstract
Bulk SiGe alloys and SiGe nanostructures exhibit relatively low thermal conductivity and have found applications in efficient thermoelectric devices. Practical measurements of thermal conductivity involve a sophisticated device design, which may not be applicable to sub-micrometer structures and devices. Raman scattering can be used to measure local temperature with a high accuracy, and it allows calculations of thermal conductivity. In this work, we present Raman data obtained for three sets of samples: partially-relaxed SiGe alloy layers with thickness close to 50 nm; planar Si/SiGe superlattices (SL) with $\sim$ 30{\%} Ge content; and three-dimensional (3D) Si/SiGe cluster multilayers with different Ge concentration and degrees of vertical self-ordering. Despite a high signal-to-noise ratio (better than 1000 to 1), quantitative analysis of Raman spectra requires proper baseline modeling and subtraction. By measuring multi-modal Stokes/anti-Stokes Raman signals and performing base line correction, we calculate local temperatures and develop a model of heat dissipation in the different SiGe and Si/SiGe nanostructures.
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Authors
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Selina Mala
New Jersey Institute of Technology
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Leonid Tsybeskov
New Jersey Institute of Technology