Enhancement of Thermoelectric Figure-of-Merit by a Nanostructure Approach

ORAL

Abstract

The dimensionless thermoelectric figure-of-merit (ZT) in bulk materials has remained about 1 for many years. Here we show that a significant ZT improvement can be achieved in nanocrystalline bulk materials. These nanocrystalline bulk materials were made by hot-pressing nanopowders that are ball-milled from either crystalline ingots or elements. Electrical transport measurements, coupled with microstructure studies and modeling, show that the ZT improvement is the result of low thermal conductivity caused by the increased phonon scattering by grain boundaries and defects. More importantly, the nanostructure approach has been successfully applied to a few thermoelectric material systems, proving its generosity. The approach can be easily scaled up to multiple tons. Thermal stability studies have shown that the nanostructures are stable at the application temperature for an extended period of time. It is expected that such enhanced materials will make the existing cooling and power generation systems more efficient.

Authors

  • Zhifeng Ren

    Physics Department, Boston College, Chestnut Hill, MA 02467, Department of Physics, Boston Colleg, Boston College

  • Bed Poudel

    GMZ Energy, Inc., GMZ Energy Inc., Boston College, GMZ Energy, Inc.

  • Yi Ma

    Boston College

  • Yucheng Lan

    Department of Physics, Boston College, Boston College

  • Xiaowei Wang

    Boston College

  • Giri Joshi

    Department of Physics, Boston College, Boston College

  • Gaohua Zhu

    Boston College

  • Jian Yang

    Boston College

  • Bo Yu

    Boston College

  • Xiao Yan

    Boston College

  • Hui Wang

    Boston College

  • Dezhi Wang

    Boston College

  • Qing Hao

    MIT

  • Hohyun Lee

    MIT

  • Austin Minnich

    MIT

  • Andrew Muto

    MIT

  • Daryoosh Vashaee

    MIT

  • Mildred Dresselhaus

    Massachusetts Institute of Technology, MIT, Department of Physics and 2. Department of Electrical Engineering and Computer Science, MIT, ECCS, MIT, USA

  • Gang Chen

    Department of Mechanical Engineering, Massachusetts Institute of Technology, MIT, Mass. Institute of Technology