Massive Integration of Nanotube/Nanowire-based Devices

Although nanotube (NT)/nanowire (NW)-based devices are drawing an attention as next generation device architecture, a lack of massive assembly method has been holding back their practical applications. In this talk, we will present a massive integration strategy of NT/NW-based devices, where surface molecular patterns guide the `selective assembly' and `alignment' of various NTs/NWs (e.g. carbon NT, vanadium oxide NWs, etc) on virtually general substrates (e.g. Au, silicon oxide, Si, Al, etc). Interestingly, NT/NW adsorbed on solid substrates exhibit `2-dimensional sliding motions' on the substrates to form desired device structures. This strategy is named here as `surface-programmed assembly' in the sense that entire assembly process can be programmed by surface molecular patterns. This process is utilized for wafer-scale fabrication of NT/NW-based devices such as high-performance transistors and bio-sensors. Importantly, since entire processing steps can be done using only conventional microfabrication facilities without any high-temperature processing, the strategy is readily accessible for conventional device industry and may open up new `NT/NW-silicon hybrid device industry' in the future. [REF: Nature 425, 26 (2003); Nature Nanotechnology 1, 66 (2006)]