Charge Transport Studies of Dielectrophoretic Interconnects Composed of Gold Nanoparticles

Dielectrophoresis was used to assemble individual, sub-micron interconnects from suspensions of gold nanoparticles and to interface them with targeted points in a circuit, all in one step. The high degree of precision associated with the photo-lithographic electrodes facilitates the determination of key electrical properties of these nanostructured interconnects. By fabricating a range of interconnects with diameters as low as 500 nm and lengths as low as 20 $\mu $m, current-voltage studies were carried out to determine the charge transport properties of these nanoparticulate structures. This work sheds light on the sources of electrical resistance in these interconnects.