Diagnostics of Plasma Properties in a Segmented-Dielectric Window Inductively Coupled Plasma System

Planar antenna-based inductively coupled plasma (ICP) systems are widely used in semiconductors processing equipment due to their scalability for large-area applications. However, conventional systems suffer from limitations in etch uniformity caused by the thick dielectric window (~30mm) and non-uniformity gas distribution. To address these issues, this study proposes a novel ICP configuration employing a segmented-dielectric window ICP (SDWICP). The system was fabricated, and its plasma characteristics were quantitatively analyzed through experiments.

SDWICP adopts a metal frame to support the segmented dielectric components, enabling the direct integration of a showerhead-type gas injection system and allowing a reduction in dielectric window thickness. This structural improvement enhances the power coupling efficiency between the antenna and plasma. However, the electromagnetic induction in the metal frame induces surface currents, which lead to RF power loss. In this presentation, we analyze this structural trade-off and compare the electromagnetic behavior, plasma density distribution, and power transfer efficiency between the proposed SDWICP and a conventional ICP system. The proposed configuration is expected to contribute effectively to high-uniformity plasma processes, particularly in plasma-enhanced atomic layer deposition applications.