Plasma Etch

Presentations

• An In-house Rigorous Etching Model for Process Recipe Tuning

  ORAL · Invited

  Oct. 7, 2021, 11:15 AM – Oct. 7, 2021, 11:45 AM

  Presenters

  • Wei Tian

    TSMC

  Authors

  • Wei Tian

    TSMC

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• In-plasma, vacuum ultraviolet photon-assisted etching of silicon

  ORAL

  Oct. 7, 2021, 11:45 AM – Oct. 7, 2021, 12:00 PM

  Presenters

  • Vincent Donnelly

    University of Houston

  Authors

  • Vincent Donnelly

    University of Houston

  • Linfeng Du

    University of Houston

  • Emilia Hirsch

    University of Houston

  • Demetre J Economou

    University of Houston

  • Paul Ruchhoeft

    University of Houston

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• Molecular dynamic simulation of glancing-angle scatterings on different materials in a high aspect ratio etching process

  ORAL

  Oct. 7, 2021, 12:00 PM – Oct. 7, 2021, 12:15 PM

  Presenters

  • Yao Du

    North Carolina State University

  Authors

  • Yao Du

    North Carolina State University

  • Steven Shannon

    North Carolina State University

  • Sang Ki Nam

    Samsung Electronics, Samsung Mechatronics R&D center, Samsung Mechatronics R&D Center, Samsung Electronics Co.

  • Hoki Lee

    Samsung Mechatronics R&D center, Samsung Mechatronics R&D Center

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• Mitigating the effects of surface charging during high aspect ratio plasma etching using voltage waveform tailoring

  ORAL

  Oct. 7, 2021, 12:15 PM – Oct. 7, 2021, 12:30 PM

  Presenters

  • Florian Krüger

    University of Michigan

  Authors

  • Florian Krüger

    University of Michigan

  • Hyunjae Lee

    Samsung Electronics

  • Sang Ki Nam

    Samsung Electronics, Samsung Mechatronics R&D center, Samsung Mechatronics R&D Center, Samsung Electronics Co.

  • Mark J Kushner

    University of Michigan, University of Michigan, Ann Arbor, Electrical Engineering and Computer Science, University of Michigan, 1301 Beal Ave, Ann Arbor, MI 48109-2122, United States of America

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• Computational study of plasma dynamics and reactive chemistry in a low-pressure inductively coupled CF₄/O₂ plasma

  ORAL

  Oct. 7, 2021, 12:30 PM – Oct. 7, 2021, 12:45 PM

  Presenters

  • Dmitry Levko

    Esgee Technologies

  Authors

  • Dmitry Levko

    Esgee Technologies

  • Chandrashekar Shukla

    Esgee Technologies

  • Rochan Upadhyay

    Esgee Technologies

  • Laxminarayan L Raja

    University of Texas at Austin, The University of Texas at Austin

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• E-H Transitions in Ar/O₂ Inductively Coupled Plasmas for Varying Antenna Aspect Ratio - Experiment

  ORAL

  Oct. 7, 2021, 12:45 PM – Oct. 7, 2021, 1:00 PM

  Presenters

  • Yuchen Qian

    University of California at Los Angeles, California State University, Los Angeles, University of California, Los Angeles

  Authors

  • Walter N Gekelman

    University of California at Los Angeles, University of California, Los Angeles

  • Patrick Pribyl

    University of California, Los Angeles

  • Yuchen Qian

    University of California at Los Angeles, California State University, Los Angeles, University of California, Los Angeles

  • Alex Paterson

    Lam Research Corp., Lam Research Corp

  • Tugba Piskin

    University of Michigan

  • Mark J Kushner

    University of Michigan, University of Michigan, Ann Arbor, Electrical Engineering and Computer Science, University of Michigan, 1301 Beal Ave, Ann Arbor, MI 48109-2122, United States of America

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• Consequences of photodetachment in pulsed Ar/O₂ and Ar/Cl₂ inductively coupled plasmas

  ORAL

  Oct. 7, 2021, 1:00 PM – Oct. 7, 2021, 1:15 PM

  Presenters

  • Tugba Piskin

    University of Michigan

  Authors

  • Tugba Piskin

    University of Michigan

  • Yuchen Qian

    University of California at Los Angeles, California State University, Los Angeles, University of California, Los Angeles

  • Patrick Pribyl

    University of California at Los Angeles, University of California, Los Angeles

  • Walter N Gekelman

    University of California at Los Angeles, University of California, Los Angeles

  • Mark J Kushner

    University of Michigan, University of Michigan, Ann Arbor, Electrical Engineering and Computer Science, University of Michigan, 1301 Beal Ave, Ann Arbor, MI 48109-2122, United States of America

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• Evaluation of charge density at hole bottom of capillary plates in a pulsed dual-frequency capacitively coupled plasma

  ORAL

  Oct. 7, 2021, 1:15 PM – Oct. 7, 2021, 1:30 PM

  Presenters

  • Haruka Suzuki

    Nagoya Univ, Nagoya Univ., Nagoya University; cLPS, Nagoya University

  Authors

  • Haruka Suzuki

    Nagoya Univ, Nagoya Univ., Nagoya University; cLPS, Nagoya University

  • Makoto Moriyama

    Nagoya Univ.

  • Naoya Nakahara

    Nagoya Univ.

  • Hirotaka Toyoda

    Nagoya Univ., NIST, Department of Electronics, Nagoya University; cLPS, Nagoya University; National Institute for Fusion Science

  View abstract →