APS Logo

Validation of Hybrid Electron Particle-In-Cell (PIC)-Ion Fluid Plasma Simulation Methodology for Low Pressure Capacitively Coupled Plasma (CCP) Chambers

ORAL

Abstract

Low-pressure (< 30 mTorr) capacitively coupled plasma (CCP) plasma sources provide the energetic sheaths that are vital in high-energy dielectric etching and high-quality film deposition applications. The kinetic behavior of electrons at low pressure cannot be adequately captured in the widely used fluid plasma models. The particle in cell (PIC) simulation methodology that accurately captures plasma behavior in this pressure range incurs prohibitively high computational cost especially when the chamber dimensions are large. In this paper, we present a hybrid PIC fluid simulation methodology where electrons are assumed to be particles while ions are treated as fluid where computational cost is reduced substantially due to reduced number of particles. The hybrid simulation methodology is compared against full PIC methodology for verification and the results are validated using experimental data. Ar, O2, and their mixtures are simulated in a low-pressure axisymmetric single and dual-frequency RF powered CCP chamber. In this chamber, ion currents and ion energy distribution functions are measured at the grounded electrode using relatively calibrated field energy analyzer sensors for different process conditions along with the corresponding bulk plasma density at different radial positions using a Langmuir probe. We validate our hybrid PIC-fluid simulations using these measurements and discuss the computational advantages and disadvantages of the proposed methodology over full PIC modeling.

Presenters

  • Sathya S Ganta

    Applied Materials Inc

Authors

  • Sathya S Ganta

    Applied Materials Inc

  • Shahid Rauf

    Applied Materials, Inc, Applied Materials, Applied Materials Inc

  • Peng Tian

    Applied Materials Inc

  • Kallol Bera

    Applied Materials Inc., Applied Materials Inc

  • Manuel Schröder

    Ruhr-University Bochum

  • Ihor Korolov

    Ruhr Univ Bochum, Institute of Electrical Engineering and Plasma Technology, Faculty of Electrical Engineering and Information Technology, Ruhr-University Bochum, Germany, Ruhr-Universität Bochum, Germany, Ruhr University Bochum, Bochum University, Ruhr Univ Bochum, Germany, Ruhr-University Bochum, Ruhr-University Bochum, Germany

  • Julian Schulze

    Ruhr University Bochum, Institute of Electrical Engineering and Plasma Technology, Faculty of Electrical Engineering and Information Technology, Ruhr-University Bochum, Germany, Ruhr Univ Bochum, Ruhr-University Bochum, Germany; Dalian University of Technology, China, Ruhr University Bochum, Dalian University of Technology, Ruch Univ Bochum, Germany, Ruhr-University Bochum