High-heat-flux processor cooling using a novel microgap device

Advancements in computer processing have become increasingly dependent on similar improvements in processor cooling. Liquid cooling by way of microgaps has proven to be a promising, more efficient alternative to established methods, such as liquid cooling using microchannels or air cooling by way of finned heat sinks. To investigate its potential, a novel microgap device was developed (Hinton and Mydlarski, US Patent No. US 11,507,153 B2, 2022). The device forms a microgap over the heated surface such that the coolant flows directly across the latter, thus eliminating multiple layers of thermal resistance. The modular nature of the design permits multiple flow configurations, such as cross flow and split flow (i.e., flow from the centerline to the edges), as well as the ability to interchange 3D-printed microgap plates, which facilitates parametric studies and the comparison of different heat transfer enhancement methods within the microgap. Experiments with a split flow microgap demonstrate an improvement in the heat transfer when compared to established methods, and this is further extended with enhancements to the microgap.