Pixel Sensor Module Production for the CMS HL-LHC Upgrade

In preparation for the High-Luminosity operations of the Large Hadron Collider, the tracker for the CMS experiment is being replaced by a new detector. The inner tracking detector upgrade uses pixelated silicon sensors that are bump bonded to a custom readout ASIC and assembled into modules that can be independently operated and tested. We describe the design of the pixel detector upgrade, the processes developed by US universities for assembling and testing the pixel sensor modules, and the future plans for detector assembly and integration.